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LA1787M

Onsemi

LA1787M by Onsemi

LA1787M by Onsemi is an audio single chip receiver with 0.3% harmonic distortion and 82 dB signal-to-noise ratio for industrial applications. It operates b/w -40 to 85 °C with a supply voltage range of 7.5-9 V, featuring AM/FM demodulation in a square-shaped flatpack package suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,359 parts In-Stock

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Digiode

USA . 1,623 parts In-Stock

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Problanco Electronics

Mexico . 5,874 parts In-Stock

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Kulean Microsystems

USA . 4,509 parts In-Stock

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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SupplyDigital Components

Austria . 2,127 parts In-Stock

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Corphita

USA . 953 parts In-Stock

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TANS Electronics

Latvia . 922 parts In-Stock

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UHIMA Technologies

Türkiye . 409 parts In-Stock

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Corohmni

South Africa . 98 parts In-Stock

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Overview

Unlock the power of crystal-clear audio with the LA1787M by Onsemi. Crafted with precision and expertise, this receiver IC offers unmatched quality and reliability for a wide range of applications. Whether you're designing a cutting-edge sound system or enhancing existing technology, the LA1787M delivers exceptional performance with minimal harmonic distortion. Enjoy seamless integration with its compact package design and high signal-to-noise ratio. Elevate your audio experience with the Onsemi LA1787M today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and reliability of the receiver IC.

Surface Mount: YES

Being surface mountable makes installation and PCB assembly easier and more efficient.

General IC Type: AUDIO SINGLE CHIP RECEIVER

The audio single chip receiver design simplifies circuitry and reduces component count, making the IC more cost-effective and space-efficient.

Nominal Signal to Noise Ratio (FM): 82 dB

With a high signal to noise ratio for FM signals, this receiver IC provides clear and high-quality audio output.

Nominal Output Voltage (AM): 195 mV

The nominal output voltage for AM signals ensures adequate signal strength for proper demodulation and audio playback.

Demodulation Type: AM/FM

Support for both AM and FM demodulation allows flexibility in receiving and decoding different types of audio signals.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this receiver IC is suitable for a wide range of operating environments and conditions.

Technical Specifications

Receiver ICs LA1787M attributes and parameters. Explore more Receiver ICs devices from Onsemi

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

.3 %

JESD-30 Code:

S-PQFP-G64

Length:

14 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (AM):

195 mV

Nominal Output Voltage (FM):

310 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

3 mm

Nominal Signal to Noise Ratio (FM):

82 dB

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

LA1787M General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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