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SA605D

NXP Semiconductors

SA605D by NXP Semiconductors

AUDIO SINGLE CHIP RECEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$2.000

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (In-Stock)

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DF Sales Co.

USA . 275 parts In-Stock

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DF Sales Co.

USA . 275 parts In-Stock

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American Microsemiconductor Inc.

USA . 199 parts In-Stock

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$4.790

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Chip Stock

USA . 8,320 parts In-Stock

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Digiode

USA . 2,655 parts In-Stock

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Anansix

USA . 2,119 parts In-Stock

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MRC Electronics

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Vyrian

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R&J Components

USA . 408 parts In-Stock

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Cogito LLC

Ukraine . 394 parts In-Stock

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Pegasus Components GmbH

Germany . 118 parts In-Stock

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Bristol Electronics

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Electronics Depot

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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A2Z Electronics, Inc.

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ECAB

Sweden . 34 parts In-Stock

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Beltway Electronics Company

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Resion

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Mil-Aero Solutions, Inc.

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Prism Electronics

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Electronic Expediters

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Atlantic Semiconductor

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GES GmbH

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Distributors (Availability)

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One Stop Electronics

USA . 883 parts In-Stock

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$19.800

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Authorized Procurement Solutions

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UNI Independent Distributors

Spain . 2,786 parts In-Stock

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Kepictronics

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Perfect Parts

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Corphita

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GreenTree Electronics

Israel . 275 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 50 parts In-Stock

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Glotronic Ltd.

UK . 40 parts In-Stock

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Technical Specifications

Receiver ICs SA605D attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

Additional Features:

IN-BUILT QUADRATURE DETECTOR

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (FM):

150 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Signal to Noise Ratio (FM):

73 dB

Maximum Supply Current:

7 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SA605D General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-453-9611, 5962014539611

NIIN

014539611

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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