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SA604AD/02J

NXP Semiconductors

SA604AD/02J by NXP Semiconductors

SA604AD/02J by NXP Semiconductors is a 16-terminal audio demodulator IC with FM demodulation type. It offers a nominal output voltage of 2650 mV and a signal to noise ratio of 73 dB for industrial applications. With a small outline package style, it operates b/w -40°C to 85°C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,593 parts In-Stock

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Flip Electronics

USA . 5,000 parts In-Stock

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5,000

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Digiode

USA . 692 parts In-Stock

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Anansix

USA . 289 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,576 parts In-Stock

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$5.800

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$5.800

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AZTECH Wire

Italy . 332 parts In-Stock

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$6.276

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332

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One Stop Electronics

USA . 250 parts In-Stock

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$21.800

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250

$21.800

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UNI Independent Distributors

Spain . 7,400 parts In-Stock

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Bastille Electronics

Australia . 3,967 parts In-Stock

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Corphita

USA . 95 parts In-Stock

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Overview

Experience crystal clear sound quality with the SA604AD/02J by NXP Semiconductors, a leading manufacturer in the industry. This receiver ICs product is perfect for audio demodulation applications, offering a high signal to noise ratio of 73dB. With a small outline package style and industrial temperature grade, this product ensures reliable performance in a compact design. Upgrade your audio systems with the SA604AD/02J for superior sound output and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection to the internal components of the receiver IC, ensuring longevity and reliability.

Surface Mount: YES

Being surface mountable, this receiver IC is relatively easy to integrate into circuit boards, saving space and simplifying the assembly process.

General IC Type: AUDIO DEMODULATOR

As an audio demodulator, this IC is specifically designed for extracting audio signals from modulated carriers, making it ideal for audio applications.

Nominal Signal to Noise Ratio (FM): 73 dB

With a high signal to noise ratio of 73 dB, this receiver IC can deliver clear and high-quality audio output, minimizing unwanted noise and interference.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage requirement of 4.5 V ensures that this IC can operate efficiently even in low voltage systems, offering flexibility in power supply options.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this receiver IC can withstand harsh environmental conditions and maintain consistent performance in demanding applications.

Technical Specifications

Receiver ICs SA604AD/02J attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (FM):

2650 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Nominal Signal to Noise Ratio (FM):

73 dB

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

SA604AD/02J General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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