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SA605D/01,118

NXP Semiconductors

SA605D/01,118 by NXP Semiconductors

SA605D/01,118 by NXP Semiconductors is an audio single chip receiver with 20 terminals. It operates b/w -40 to 85 °C and offers a signal-to-noise ratio of 73 dB for FM demodulation. Ideal for industrial applications requiring a compact rectangular package with surface mount capability.

Median Price

$2.960

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,944 parts In-Stock

1+ parts

$2.960

100+ parts

$2.900

1k+ parts

$2.840

10k+ parts

-

6,944

$2.960

$2.900

$2.840

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,312 parts In-Stock

1+ parts

$2.812

100+ parts

-

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4,312

$2.812

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-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$5.689

100+ parts

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100

$5.689

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Vyrian

USA . 2,748 parts In-Stock

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2,748

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Flip Electronics

USA . 1,955 parts In-Stock

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1,955

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Anansix

USA . 208 parts In-Stock

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208

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Distributors (Availability)

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Corohmni

South Africa . 77 parts In-Stock

1+ parts

$1.443

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-

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77

$1.443

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Semicontronic

India . 6,825 parts In-Stock

1+ parts

$2.520

100+ parts

$2.457

1k+ parts

$2.444

10k+ parts

-

6,825

$2.520

$2.457

$2.444

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Ampacity Inc.

Singapore . 6,610 parts In-Stock

1+ parts

$2.520

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-

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6,610

$2.520

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Corphita

USA . 800 parts In-Stock

1+ parts

$2.664

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800

$2.664

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Aztec Data Supply Inc.

USA . 662 parts In-Stock

1+ parts

$3.680

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-

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662

$3.680

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Modulus Dynamics

Lithuania . 1,728 parts In-Stock

1+ parts

$3.865

100+ parts

$3.865

1k+ parts

$3.865

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1,728

$3.865

$3.865

$3.865

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Continental Prestige Electronics

USA . 1,317 parts In-Stock

1+ parts

$5.160

100+ parts

$3.440

1k+ parts

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1,317

$5.160

$3.440

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AZTECH Wire

Italy . 1,113 parts In-Stock

1+ parts

$11.700

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1,113

$11.700

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UNI Independent Distributors

Spain . 7,613 parts In-Stock

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Argo Parts USA

USA . 4,796 parts In-Stock

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4,796

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Perfect Parts

USA . 3,515 parts In-Stock

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3,515

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Advanced Electronics

New Zealand . 550 parts In-Stock

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550

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Overview

Discover the cutting-edge SA605D/01,118 by NXP Semiconductors, a top-of-the-line AUDIO SINGLE CHIP RECEIVER designed to deliver superior performance and reliability. With a compact design and high signal-to-noise ratio, this receiver IC is perfect for a wide range of applications, from car radio systems to home audio devices. Benefit from NXP's reputation for quality and innovation, and elevate your audio experience with the SA605D/01,118. Unlock the full potential of your audio projects with this state-of-the-art receiver IC.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY:

This material provides durability and protection for the IC, making it suitable for various applications.

Surface Mount YES:

This feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape RECTANGULAR:

The rectangular shape of the package makes it easy to handle and integrate into different electronic devices.

General IC Type AUDIO SINGLE CHIP RECEIVER:

This single chip receiver simplifies circuit design and assembly, reducing space requirements and cost.

No. of Terminals 20:

The ample number of terminals allows for flexible connections and compatibility with various circuit configurations.

Package Style (Meter) SMALL OUTLINE:

The compact small outline package saves space on the circuit board, ideal for compact electronic designs.

Maximum Operating Temperature 85 °C:

With a high maximum operating temperature, this IC can withstand harsh environmental conditions, ensuring long-term reliability.

Minimum Operating Temperature -40 °C:

The wide temperature range allows the IC to operate in extreme cold conditions, making it versatile for different applications.

Terminal Finish NICKEL PALLADIUM GOLD:

The high-quality terminal finish ensures reliable electrical connections and corrosion resistance for a longer lifespan.

Terminal Position DUAL:

Dual terminal position provides redundancy and multiple connection options for increased flexibility in circuit design.

Maximum Seated Height 2.65 mm:

The low-profile design with a maximum seated height makes it suitable for slim and compact electronic devices.

Nominal Signal to Noise Ratio (FM) 73 dB:

The high signal-to-noise ratio provides clear and high-quality audio output, enhancing overall performance.

Width 7.5 mm:

The compact width allows for space-efficient placement on the circuit board, ideal for miniaturized electronic devices.

Minimum Supply Voltage (Vsup) 4.5 V:

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Peak Reflow Temperature °C 260:

The high peak reflow temperature capability ensures reliable soldering during assembly, reducing the risk of component damage.

Length 12.8 mm:

The moderate length is suitable for various applications, offering a balance between space-saving and functionality.

Demodulation Type FM:

The FM demodulation type provides efficient and reliable signal decoding for clear audio reception.

Temperature Grade INDUSTRIAL:

The industrial temperature grade ensures stable performance in demanding industrial environments.

Terminal Form GULL WING:

The gull wing terminal form offers secure and robust solder connections, ensuring long-term reliability in operation.

Nominal Output Voltage (FM) 150 mV:

The high nominal output voltage ensures strong audio signals for excellent sound quality and performance.

Terminal Pitch 1.27 mm:

The standard terminal pitch allows for easy and precise soldering and connection with other components on the circuit board.

Maximum Supply Voltage (Vsup) 8 V:

The high maximum supply voltage capability ensures compatibility with various power sources for versatile applications.

Technical Specifications

Receiver ICs SA605D/01,118 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

Additional Features:

IN-BUILT QUADRATURE DETECTOR

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (FM):

150 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Signal to Noise Ratio (FM):

73 dB

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SA605D/01,118 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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