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TEA5711PN

NXP Semiconductors

TEA5711PN by NXP Semiconductors

TEA5711PN by NXP Semiconductors is a versatile audio single-chip receiver with a harmonic distortion of 0.8% and an SNR of 26 dB. It operates b/w -15 °C to 60 °C, making it ideal for commercial applications. This compact IC features a dual terminal design in a rectangular package.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 2,382 parts In-Stock

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Vyrian

USA . 855 parts In-Stock

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Anansix

USA . 300 parts In-Stock

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One Stop Electronics

USA . 1,120 parts In-Stock

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$6.800

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Corphita

USA . 2,443 parts In-Stock

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UNI Independent Distributors

Spain . 1,418 parts In-Stock

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Overview

Elevate your audio experience with the TEA5711PN from NXP Semiconductors—a trusted leader in innovative technology. This high-quality receiver IC delivers exceptional sound clarity and reliability, making it perfect for various applications, from consumer electronics to professional audio systems. Enjoy the benefits of a compact design and robust performance, ensuring your devices resonate with superior sound quality while maintaining energy efficiency. Choose TEA5711PN for a cutting-edge solution that enhances your audio projects effortlessly!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on PCB, enabling more compact designs.

General IC Type: AUDIO SINGLE CHIP RECEIVER

Single chip design simplifies integration and lowers overall system complexity while maintaining high performance in audio applications.

Harmonic Distortion: 0.8%

Low harmonic distortion ensures high-quality audio output, making this IC ideal for high-fidelity applications.

No. of Terminals: 32

The large number of terminals allows for extensive functionality and flexibility in connectivity options.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line shrink pitch package style facilitates easier handling and placement during assembly.

Maximum Operating Temperature: 60 °C

Operating at high temperatures up to 60 °C ensures reliability in warm environments.

Minimum Operating Temperature: -15 °C

With a low minimum operating temperature of -15 °C, this product is suitable for use in cold climates.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

The premium terminal finish enhances solderability and prevents corrosion, ensuring a long-lasting connection.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility and ease of integration into various circuit designs.

Maximum Seated Height: 4.7 mm

A low seated height allows for slim profiles in end products, contributing to space-saving designs.

Nominal Signal to Noise Ratio (FM): 26 dB

A nominal SNR of 26 dB indicates good audio clarity and minimal noise interference, crucial for quality audio reception.

Width: 10.16 mm

A compact width allows for efficient placement on PCBs, enabling tighter layouts in electronic designs.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage of 2 V allows for energy-efficient designs and compatibility with battery-operated applications.

Length: 28.95 mm

A reasonable length offers an optimal balance between space efficiency and functionality in circuit design.

Nominal Output Voltage (AM): 45 mV

A nominal AM output voltage of 45 mV indicates strong performance in amplitude modulation reception.

Demodulation Type: AM/FM

Support for both AM and FM demodulation makes this IC versatile, suitable for a wide range of audio signal reception.

Temperature Grade: COMMERCIAL

Commercial grade ensures reliability in standard commercial temperature ranges suitable for everyday applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal design provides robust mechanical stability during assembly and is preferred in many industrial applications.

Nominal Output Voltage (FM): 65 mV

The 65 mV FM output voltage guarantees strong signal performance, enhancing audio quality in FM applications.

Terminal Pitch: 1.778 mm

A terminal pitch of 1.778 mm allows for compatibility with standard PCB designs, assuring ease of integration.

Maximum Supply Voltage (Vsup): 12 V

The capability to operate up to 12 V maximizes flexibility in system design, accommodating a variety of power supply configurations.

Technical Specifications

Receiver ICs TEA5711PN attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

.8 %

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e3/e4

Length:

28.95 mm

No. of Terminals:

32

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-15 Cel

Nominal Output Voltage (AM):

45 mV

Nominal Output Voltage (FM):

65 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Nominal Signal to Noise Ratio (FM):

26 dB

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

TEA5711PN General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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