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TEA5594PN

NXP Semiconductors

TEA5594PN by NXP Semiconductors

TEA5594PN by NXP Semiconductors is an audio single-chip receiver IC designed for industrial applications. It operates b/w -40 °C to 85 °C, with a max supply voltage of 15V and delivers nominal output voltages of 50mV (AM) and 90mV (FM). Its compact design features a rectangular package with 32 terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 3,038 parts In-Stock

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Vyrian

USA . 1,151 parts In-Stock

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Anansix

USA . 678 parts In-Stock

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One Stop Electronics

USA . 527 parts In-Stock

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$14.800

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UNI Independent Distributors

Spain . 2,240 parts In-Stock

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Corphita

USA . 1,461 parts In-Stock

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Overview

Elevate your audio applications with the TEA5594PN from NXP Semiconductors, a trusted leader in innovative technology. This high-performance receiver IC enhances sound quality while ensuring robust reliability across diverse environments—from industrial setups to consumer electronics. With its compact design and exceptional demodulation capabilities, you gain superior audio clarity and efficiency, empowering your projects with unmatched performance and value. Experience the NXP advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body offers durability and resistance to environmental factors, making it suitable for various applications.

Package Shape: RECTANGULAR

A rectangular package shape allows for efficient use of board space and simplifies assembly.

General IC Type: AUDIO SINGLE CHIP RECEIVER

As an audio single chip receiver, this IC integrates multiple functions into a single device, reducing circuit complexity and saving space.

Harmonic Distortion: 0.8%

With a low harmonic distortion of 0.8%, this IC ensures high fidelity audio performance, making it ideal for high-quality audio applications.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options, enhancing functionality and adaptability in various circuit designs.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch package style is designed for easy handling and efficient manufacturing, offering a compact footprint.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows this IC to function reliably in demanding environments, suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C ensures consistent performance in extremely cold conditions, making it reliable for outdoor and harsh settings.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

The tin/nickel palladium gold terminal finish provides excellent corrosion resistance and solderability, ensuring longevity in connections.

Terminal Position: DUAL

Dual terminal positions enhance flexibility in design, allowing for more versatile layouts in PCB design.

Maximum Seated Height: 4.7 mm

A maximum seated height of 4.7 mm allows for compact designs while still providing compatibility with various PCB layouts.

Width: 10.16 mm

The 10.16 mm width contributes to a compact size, which is advantageous in space-constrained applications.

Minimum Supply Voltage (Vsup): 2.7 V

A minimum supply voltage of 2.7 V allows the IC to operate in low-power applications, enhancing battery life in portable devices.

Length: 28.95 mm

The length of 28.95 mm provides a balance between size and functionality, suitable for both compact and more spacious designs.

Nominal Output Voltage (AM): 50 mV

The nominal output voltage of 50 mV for AM signals ensures compatibility with a wide range of audio applications, providing good signal strength.

Demodulation Type: AM/FM

Supporting both AM and FM demodulation, this IC is versatile for various audio applications, enhancing its usability.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates this IC can withstand harsh conditions, making it suitable for industrial automation and control systems.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical stability, making it suitable for environments where higher durability is required.

Nominal Output Voltage (FM): 90 mV

A nominal output voltage of 90 mV for FM signals ensures clear audio production, making it ideal for modern audio systems.

Terminal Pitch: 1.778 mm

The 1.778 mm terminal pitch offers compatibility with standard PCB layouts, ensuring ease of mounting and soldering.

Maximum Supply Voltage (Vsup): 15 V

A maximum supply voltage of 15 V allows for flexibility in various applications, accommodating higher power requirements for demanding devices.

Technical Specifications

Receiver ICs TEA5594PN attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

.8 %

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e3/e4

Length:

28.95 mm

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (AM):

50 mV

Nominal Output Voltage (FM):

90 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

TEA5594PN General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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