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LM1863M

Texas Instruments

LM1863M by Texas Instruments

LM1863M by Texas Instruments is an audio single chip receiver with 0.63% harmonic distortion. It operates b/w 0-70°C, has a supply voltage range of 7-16V, and outputs 120mV nominal voltage in AM demodulation. This small outline IC is ideal for commercial-grade applications requiring high-quality audio reception.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,951 parts In-Stock

1+ parts

-

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7,951

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Digiode

USA . 3,547 parts In-Stock

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3,547

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Anansix

USA . 852 parts In-Stock

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852

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 375 parts In-Stock

1+ parts

$3.247

100+ parts

-

1k+ parts

$3.767

10k+ parts

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375

$3.247

-

$3.767

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DigiPath Technology Company

USA . 466 parts In-Stock

1+ parts

$3.575

100+ parts

$3.289

1k+ parts

-

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466

$3.575

$3.289

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IDEA Electronic Components Group

UK . 2,253 parts In-Stock

1+ parts

$3.648

100+ parts

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$3.283

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2,253

$3.648

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$3.283

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ChromeModa Solutions

Germany . 1,663 parts In-Stock

1+ parts

$3.648

100+ parts

$2.991

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1,663

$3.648

$2.991

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One Stop Electronics

USA . 1,359 parts In-Stock

1+ parts

$5.800

100+ parts

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1,359

$5.800

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AZTECH Wire

Italy . 699 parts In-Stock

1+ parts

$15.468

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699

$15.468

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Corphita

USA . 5,002 parts In-Stock

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5,002

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Overview

Elevate your audio experience with the LM1863M by Texas Instruments, a top-notch receiver IC designed to deliver high-quality sound performance. Manufactured by the reputable Texas Instruments, this audio single chip receiver boasts superior quality and reliability. Perfect for a wide range of applications in the audio industry, this small outline package offers customers exceptional value and benefits. Upgrade your audio system today with the LM1863M and enjoy crystal-clear sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and robustness, making this product suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards, saving time and cost.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, saving space in electronic devices.

Harmonic Distortion: 0.63%

Low harmonic distortion ensures high-quality audio output, making this receiver IC ideal for audio applications.

No. of Terminals: 20

The higher number of terminals allows for more connectivity options, offering versatility in circuit design.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this receiver IC can withstand demanding conditions without overheating.

Minimum Supply Voltage (Vsup): 7 V

The low minimum supply voltage requirement allows for flexibility in power source selection.

Nominal Output Voltage (AM): 120 mV

The nominal output voltage ensures a stable and consistent audio output signal.

Technical Specifications

Receiver ICs LM1863M attributes and parameters. Explore more Receiver ICs devices from Texas Instruments

Specs

General IC Type:

Demodulation Type:

AM

Harmonic Distortion:

.63 %

JESD-30 Code:

R-PDSO-G20

Length:

12.8015 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Voltage (AM):

120 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.642 mm

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.493 mm

Trade Compliance

LM1863M General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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