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TDA7361

STMicroelectronics

TDA7361 by STMicroelectronics

TDA7361 from STMicroelectronics is a versatile receiver IC designed for automotive applications. It operates on power supplies ranging from 1.8V to 9V, features a dual terminal position, and supports temperatures up to 70 °C. Its compact in-line package ensures efficient integration into various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Vyrian

USA . 4,501 parts In-Stock

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Digiode

USA . 1,663 parts In-Stock

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Anansix

USA . 1,091 parts In-Stock

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ECAB

Sweden . 275 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 61 parts In-Stock

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LittleDiode

UK . 10 parts In-Stock

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GES GmbH

Germany . 5 parts In-Stock

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Huijzer Components

Netherlands . 1 parts In-Stock

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IDEA Electronic Components Group

UK . 1,380 parts In-Stock

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$0.111

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MKK Technologies

India . 889 parts In-Stock

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DigiPath Technology Company

USA . 889 parts In-Stock

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Corphita

USA . 4,404 parts In-Stock

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Parana Technologies

USA . 1,630 parts In-Stock

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Kepictronics

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Assy Fe

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Overview

Elevate your audio experience with the TDA7361 from STMicroelectronics, a leader in innovative semiconductor solutions. This robust receiver IC delivers exceptional sound quality and reliability, making it ideal for automotive, home entertainment, and portable applications. With its versatile voltage range and commercial-grade durability, the TDA7361 ensures seamless integration into your projects, providing unmatched performance and value that meets the demands of modern users.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides excellent protection against environmental factors, ensuring the longevity and reliability of the Receiver IC.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space, making it easier to integrate into various designs.

Power Supplies (V): 1.8/9

Supports a wide range of operating voltages, enhancing flexibility for different applications and systems.

No. of Terminals: 16

A sufficient number of terminals facilitate connectivity and functionality, allowing for robust performance in communication applications.

Package Style (Meter): IN-LINE

The in-line package style is ideal for through-hole applications, simplifying assembly and improving reliability.

Maximum Operating Temperature: 70 °C

With a relatively high maximum operating temperature, this product can perform well in diverse environments without overheating.

Minimum Operating Temperature: 0 °C

This product can operate in low-temperature conditions, making it suitable for a wide variety of applications, including outdoor settings.

Terminal Finish: TIN LEAD

The tin-lead finish provides excellent solderability and ensures a strong electrical connection, enhancing overall performance.

Terminal Position: DUAL

Dual terminal positions allow for more versatile mounting options, making the IC easier to incorporate into different circuit designs.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product guarantees reliability and performance in standard operating conditions.

Technology: BIPOLAR

Utilizing bipolar technology ensures high speed and efficient signal processing, vital for receiver applications.

Terminal Form: THROUGH-HOLE

Through-hole technology leads to strong mechanical support and stability, making assembly easier and more durable.

Terminal Pitch: 2.54 mm

A standard terminal pitch provides compatibility with a wide range of circuit boards, ensuring ease of integration.

Technical Specifications

Receiver ICs TDA7361 attributes and parameters. Explore more Receiver ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

1.8/9

Qualification:

Not Qualified

Sub-Category:

Receiver ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TDA7361 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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