Loading...

TDA7513

STMicroelectronics

TDA7513 by STMicroelectronics

TDA7513 by STMicroelectronics is a low-profile audio single-chip receiver designed for AM/FM applications. It features a 66 dB SNR, 3% harmonic distortion, and operates with supply voltages b/w 8V. Ideal for compact audio systems, it ensures high-quality sound output.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,165 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,165

-

-

-

-

Anansix

USA . 1,908 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,908

-

-

-

-

Vyrian

USA . 1,432 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,432

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 325 parts In-Stock

1+ parts

$1.080

100+ parts

-

1k+ parts

$0.972

10k+ parts

-

325

$1.080

-

$0.972

-

MKK Technologies

India . 252 parts In-Stock

1+ parts

$2.031

100+ parts

-

1k+ parts

-

10k+ parts

-

252

$2.031

-

-

-

DigiPath Technology Company

USA . 252 parts In-Stock

1+ parts

$2.031

100+ parts

-

1k+ parts

-

10k+ parts

-

252

$2.031

-

-

-

A-Z Elektronik GmbH

Germany . 5,706 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,706

-

-

-

-

Corphita

USA . 3,845 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,845

-

-

-

-

Parana Technologies

USA . 1,768 parts In-Stock

1+ parts

-

100+ parts

$1.291

1k+ parts

-

10k+ parts

-

1,768

-

$1.291

-

-

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Perfect Parts

USA . 168 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

168

-

-

-

-

Futuretech Components

Singapore . 71 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

71

-

-

-

-

Kepictronics

USA . 71 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

71

-

-

-

-

Overview

Elevate your audio experience with the TDA7513 from STMicroelectronics, a leader in innovative technology. This advanced audio single-chip receiver delivers exceptional sound quality, ensuring crystal-clear AM/FM demodulation with minimal distortion. Compact and efficient, its low-profile design seamlessly integrates into various applications, making it ideal for automotive and consumer electronics. Trust in STMicroelectronics' commitment to excellence and unlock the full potential of your audio systems!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and provides excellent protection against environmental factors, making it a reliable choice for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration into modern circuit boards, promoting a compact design and reducing assembly time.

Package Shape: SQUARE

A square package shape optimizes space utilization on the PCB, making it suitable for space-constrained applications.

General IC Type: AUDIO SINGLE CHIP RECEIVER

As an audio single-chip receiver, this product is ideal for audio transmission applications, simplifying the design and enhancing performance.

Harmonic Distortion: 3 %

With a harmonic distortion of only 3%, this IC ensures high-quality audio reproduction, making it suitable for premium audio devices.

No. of Terminals: 80

The large number of terminals (80) allows for extensive connectivity options, supporting complex circuit implementations.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack low-profile design enables compact placements within electronic devices, ideal for mobile and portable applications.

Terminal Position: QUAD

The quad terminal position provides flexible mounting options and ease of access for soldering, enhancing its usability in various designs.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm allows this IC to fit in tight spaces, ensuring compatibility with slim designs.

Nominal Signal to Noise Ratio (FM): 66 dB

A high signal to noise ratio of 66 dB ensures superior audio quality, making it an excellent choice for professional audio applications.

Width: 14 mm

The 14 mm width strikes a balance between compact design and sufficient space for connectivity, suitable for various PCB layouts.

Minimum Supply Voltage (Vsup): 8 V

The minimum supply voltage of 8 V ensures consistent operation under typical conditions, making it reliable for standard applications.

Nominal Output Voltage (AM): 266 mV

The nominal output voltage of 266 mV for AM makes it effective for various amplitude modulation applications, ensuring clear signal transmission.

Demodulation Type: AM/FM

Supporting both AM and FM demodulation types provides versatility in application, allowing this receiver IC to be used in multiple audio systems.

Nominal Output Voltage (FM): 375 mV

A nominal output voltage of 375 mV for FM operations ensures adequate signal strength, enhancing the performance of FM audio systems.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm offers a good compromise between miniaturization and ease of soldering, facilitating efficient PCB designs.

Maximum Supply Voltage (Vsup): 8 V

With a maximum supply voltage of 8 V, this IC remains energy-efficient, reducing power consumption while delivering reliable performance.

Technical Specifications

Receiver ICs TDA7513 attributes and parameters. Explore more Receiver ICs devices from STMicroelectronics

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

3 %

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of Functions:

1

No. of Terminals:

80

Nominal Output Voltage (AM):

266 mV

Nominal Output Voltage (FM):

375 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Signal to Noise Ratio (FM):

66 dB

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

TDA7513 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19