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TDA7000

NXP Semiconductors

TDA7000 by NXP Semiconductors

NXP Semiconductors' TDA7000 is an audio single chip receiver IC with 18 terminals. It offers FM demodulation, 2.3% harmonic distortion, and a nominal output voltage of 75mV. Ideal for commercial temperature grade applications requiring a signal to noise ratio of 60dB in a compact rectangular package style.

Median Price

$16.850

Lifecycle Status

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American Microsemiconductor Inc.

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Forefront Electronics and Design

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Vyrian

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Nova Conductors

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Corohmni

South Africa . 295 parts In-Stock

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One Stop Electronics

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Overview

Discover the superior audio quality and performance of the TDA7000 by NXP Semiconductors, a leading manufacturer in receiver ICs. This versatile single chip receiver offers unmatched value and benefits for a wide range of applications. With low harmonic distortion and high signal-to-noise ratio, this compact and efficient device delivers crystal-clear sound while operating within a wide temperature range. Experience the reliability and innovation of NXP Semiconductors with the TDA7000, perfect for amplifying your audio projects with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and corrosion resistance, making the product long-lasting.

Harmonic Distortion: 2.3 %

Low harmonic distortion ensures high-quality audio output with minimal interference or distortion.

Nominal Signal to Noise Ratio (FM): 60 dB

High signal to noise ratio ensures clear reception and excellent audio quality.

Maximum Operating Temperature: 60 °C

Wide operating temperature range allows the product to perform efficiently in various environmental conditions.

Nominal Output Voltage (FM): 75 mV

Provides a strong output voltage for audio signals, ensuring adequate volume levels.

Technical Specifications

Receiver ICs TDA7000 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

FM

Harmonic Distortion:

2.3 %

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e3/e4

Length:

21.6 mm

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Voltage (FM):

75 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Nominal Signal to Noise Ratio (FM):

60 dB

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TDA7000 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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