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TDA7512

STMicroelectronics

TDA7512 by STMicroelectronics

TDA7512 by STMicroelectronics is a low-profile audio single-chip receiver designed for industrial applications. It features a harmonic distortion of just 1%, operates b/w -40 °C to 85 °C, and supports AM/FM demodulation. This versatile IC comes in a compact 10mm x 10mm package with 64 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,455 parts In-Stock

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4,455

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Anansix

USA . 1,994 parts In-Stock

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1,994

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Digiode

USA . 1,456 parts In-Stock

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1,456

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,616 parts In-Stock

1+ parts

$2.062

100+ parts

-

1k+ parts

$1.856

10k+ parts

-

1,616

$2.062

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$1.856

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MKK Technologies

India . 1,167 parts In-Stock

1+ parts

$3.877

100+ parts

-

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1,167

$3.877

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DigiPath Technology Company

USA . 1,167 parts In-Stock

1+ parts

$3.877

100+ parts

-

1k+ parts

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10k+ parts

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1,167

$3.877

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A-Z Elektronik GmbH

Germany . 6,563 parts In-Stock

1+ parts

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6,563

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Corphita

USA . 2,692 parts In-Stock

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2,692

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Assy Fe

Spain . 1,920 parts In-Stock

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1,920

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Parana Technologies

USA . 1,812 parts In-Stock

1+ parts

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100+ parts

$2.465

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1,812

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$2.465

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Kepictronics

USA . 1,704 parts In-Stock

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1,704

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Overview

Elevate your audio experience with the TDA7512 from STMicroelectronics, a leader in innovative electronics. This versatile audio receiver IC delivers exceptional sound quality and reliability, perfect for automotive, industrial, and consumer applications. With its low distortion and robust temperature range, it ensures optimal performance in any environment. Choose the TDA7512 to enjoy superior audio clarity and unmatched durability, empowering your next project with cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability facilitates efficient use of PCB space and allows for automated assembly processes.

Package Shape: SQUARE

A square package shape contributes to a compact design which is advantageous for space-constrained applications.

General IC Type: AUDIO SINGLE CHIP RECEIVER

Being a dedicated audio single chip receiver enhances performance, ensuring high-quality audio output in various applications.

Harmonic Distortion: 1%

Low harmonic distortion indicates high fidelity in audio reproduction, making this IC ideal for applications that demand clear sound.

No. of Terminals: 64

A higher number of terminals provides greater connectivity options, allowing for more complex circuit designs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack and low profile design makes it suitable for integration into compact electronic devices without compromising performance.

Maximum Operating Temperature: 85 °C

Withstanding high temperatures ensures reliability in demanding environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Ability to operate in low temperatures expands the range of applications, particularly in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: QUAD

Quad terminal positioning offers flexible mounting options, simplifying PCB design and layout.

Maximum Seated Height: 1.6 mm

Low seated height allows for a sleek profile in electronic designs, maintaining aesthetic appeal in consumer products.

Width: 10 mm

A compact width aids in fitting within tight spaces on circuit boards, enhancing design flexibility.

Minimum Supply Voltage (Vsup): 7.5 V

Allows for a range of operational voltages, making it adaptable for various power supply configurations.

Length: 10 mm

The short length contributes to a compact footprint on PCBs, ideal for miniaturized electronic devices.

Demodulation Type: AM/FM

Supports both AM and FM demodulation, making it versatile for a wide range of audio applications.

Temperature Grade: INDUSTRIAL

Designed for industrial applications ensures it can handle rigorous conditions, thus enhancing durability and longevity.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance with low power consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve the reliability of connections during assembly.

Terminal Pitch: 0.5 mm

Fine pitch allows for high-density circuit designs, maximizing the functionalities packed into smaller spaces.

Maximum Supply Voltage (Vsup): 10 V

Allows for a robust performance range, accommodating various audio applications requiring different voltage levels.

Technical Specifications

Receiver ICs TDA7512 attributes and parameters. Explore more Receiver ICs devices from STMicroelectronics

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

1 %

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TDA7512 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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