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TDA7222AD

STMicroelectronics

TDA7222AD by STMicroelectronics

TDA7222AD by STMicroelectronics is an audio single chip receiver with 1% harmonic distortion, 70 dB signal-to-noise ratio for FM, and operates b/w 0-70 °C. It has a small outline package with 28 terminals and demodulates AM/FM signals. Ideal for commercial-grade applications requiring low supply voltage (1.8V) and max current of 20mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,738

-

-

-

-

Anansix

USA . 2,350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,350

-

-

-

-

Vyrian

USA . 619 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

619

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 870 parts In-Stock

1+ parts

$2.132

100+ parts

-

1k+ parts

$1.918

10k+ parts

-

870

$2.132

-

$1.918

-

MKK Technologies

India . 1,617 parts In-Stock

1+ parts

$4.008

100+ parts

-

1k+ parts

-

10k+ parts

-

1,617

$4.008

-

-

-

DigiPath Technology Company

USA . 1,617 parts In-Stock

1+ parts

$4.008

100+ parts

-

1k+ parts

-

10k+ parts

-

1,617

$4.008

-

-

-

Corphita

USA . 1,722 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,722

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-

-

-

Parana Technologies

USA . 776 parts In-Stock

1+ parts

-

100+ parts

$2.549

1k+ parts

-

10k+ parts

-

776

-

$2.549

-

-

Overview

Experience superior audio quality with the TDA7222AD by STMicroelectronics, a leading manufacturer of receiver ICs. This compact and versatile audio single chip receiver offers unparalleled performance with low harmonic distortion and high signal-to-noise ratio. Ideal for a wide range of applications, this product delivers exceptional value and benefits to customers looking for reliable and efficient audio solutions. Trust STMicroelectronics to provide you with cutting-edge technology that meets your audio needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable, the product is easy to assemble and saves space on the PCB.

Package Shape: RECTANGULAR

Rectangular package shape provides ease of handling and installation.

General IC Type: AUDIO SINGLE CHIP RECEIVER

The single chip design simplifies the circuitry and reduces system complexity.

Harmonic Distortion: 1 %

Low harmonic distortion ensures high quality audio output.

No. of Terminals: 28

Having more terminals allows for greater connectivity options.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand prolonged use in various environments.

Minimum Operating Temperature: 0 °C

The product can operate in a wide temperature range, making it suitable for different applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and ensures long-term reliability.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting options.

Nominal Signal to Noise Ratio (FM): 70 dB

High signal to noise ratio ensures clear and high-quality FM audio reception.

Minimum Supply Voltage (Vsup): 1.8 V

Low minimum supply voltage requirement makes the product suitable for low power applications.

Nominal Output Voltage (AM): 80 mV

Stable output voltage for AM signal ensures consistent performance.

Demodulation Type: AM/FM

Supports both AM and FM demodulation for versatile functionality.

Temperature Grade: COMMERCIAL

Commercial temperature grade makes the product suitable for standard operating conditions.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering.

Maximum Supply Current: 20 mA

Low maximum supply current requirement helps in reducing power consumption.

Nominal Output Voltage (FM): 80 mV

Consistent output voltage for FM signal ensures reliable performance.

Maximum Supply Voltage (Vsup): 7 V

Wide maximum supply voltage range allows for flexibility in power supply options.

Technical Specifications

Receiver ICs TDA7222AD attributes and parameters. Explore more Receiver ICs devices from STMicroelectronics

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

1 %

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Voltage (AM):

80 mV

Nominal Output Voltage (FM):

80 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Nominal Signal to Noise Ratio (FM):

70 dB

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

7 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

TDA7222AD General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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