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TDA7705TR

STMicroelectronics

TDA7705TR by STMicroelectronics

TDA7705TR from STMicroelectronics is a versatile audio/video demodulator in a 64-terminal flatpack design. It features a peak reflow temp of 260 °C, moisture sensitivity level 3, and surface mount capability. Ideal for advanced receiver applications in consumer electronics.

Median Price

$9.296

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 14,048 parts In-Stock

1+ parts

$9.296

100+ parts

$4.028

1k+ parts

$3.811

10k+ parts

-

14,048

$9.296

$4.028

$3.811

-

Vyrian

USA . 7,074 parts In-Stock

1+ parts

-

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-

1k+ parts

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7,074

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-

-

-

Anansix

USA . 876 parts In-Stock

1+ parts

-

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-

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876

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-

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Cyclops Electronics Ltd

UK . 841 parts In-Stock

1+ parts

-

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841

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Digiode

USA . 747 parts In-Stock

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747

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 695 parts In-Stock

1+ parts

$2.122

100+ parts

-

1k+ parts

$1.910

10k+ parts

-

695

$2.122

-

$1.910

-

MKK Technologies

India . 1,754 parts In-Stock

1+ parts

$3.991

100+ parts

-

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-

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1,754

$3.991

-

-

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DigiPath Technology Company

USA . 1,754 parts In-Stock

1+ parts

$3.991

100+ parts

-

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-

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1,754

$3.991

-

-

-

AZTECH Wire

Italy . 483 parts In-Stock

1+ parts

$13.380

100+ parts

-

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483

$13.380

-

-

-

RC Electronics

USA . 24,165 parts In-Stock

1+ parts

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24,165

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Futuretech Components

Singapore . 10,000 parts In-Stock

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10,000

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A-Z Elektronik GmbH

Germany . 7,227 parts In-Stock

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7,227

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Kepictronics

USA . 5,120 parts In-Stock

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5,120

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Authorized Procurement Solutions

USA . 3,432 parts In-Stock

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3,432

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Corphita

USA . 3,086 parts In-Stock

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3,086

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Perfect Parts

USA . 2,240 parts In-Stock

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2,240

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Infinite Electronics LLP (Excess)

. 1,675 parts In-Stock

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1,675

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Parana Technologies

USA . 479 parts In-Stock

1+ parts

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100+ parts

$2.538

1k+ parts

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10k+ parts

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479

-

$2.538

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Metaverse IC Inc.

Canada . 297 parts In-Stock

1+ parts

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100+ parts

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297

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Overview

Elevate your audio and video solutions with the TDA7705TR from STMicroelectronics, a leader in innovation. This versatile receiver IC excels in delivering high-quality demodulation for a wide range of applications, ensuring crystal-clear performance. Its reliable design and advanced features provide unmatched value, making it perfect for automotive, consumer electronics, and industrial uses. Choose TDA7705TR for a seamless integration of quality and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package ensures good protection against environmental factors, making this product durable and reliable for various applications.

Surface Mount: YES

Being a surface mount component allows for easier installation on PCBs, saving space and enabling high-density designs, which is crucial in modern electronics.

Package Shape: SQUARE

The square package shape optimizes board layout and thermal management, helping to improve overall performance in compact electronic assemblies.

General IC Type: AUDIO/VIDEO DEMODULATOR

As an audio/video demodulator, this IC is specifically designed for high-quality signal processing, making it ideal for multimedia applications and consistent performance.

No. of Terminals: 64

With 64 terminals, this IC provides ample connectivity options for complex circuits, facilitating advanced functionality and integration in sophisticated systems.

Package Style (Meter): FLATPACK

The flatpack style contributes to lower profile designs, enhancing the feasibility of applications where height constraints are critical.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures excellent conductivity and resistance to corrosion, enhancing the longevity and reliability of electrical connections.

Terminal Position: QUAD

Quad terminal positioning allows for better layout options on PCBs, facilitating efficient signal routing and contributing to overall system performance.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds reduces the risk of thermal damage during soldering, ensuring integrity and reliability of the component.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C is compatible with various soldering processes, making this IC versatile for manufacturers using different assembly techniques.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and solder joint reliability, ensuring robust connections in demanding applications.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this IC offers a reasonable level of moisture resistance, making it suitable for applications with controlled environments and moderate handling.

Technical Specifications

Receiver ICs TDA7705TR attributes and parameters. Explore more Receiver ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TDA7705TR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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