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TDA7220

STMicroelectronics

TDA7220 by STMicroelectronics

TDA7220 by STMicroelectronics is an audio demodulator IC with 16 terminals. It offers a harmonic distortion of 1.1%, nominal SNR of 65 dB for FM, and operates b/w -20 to 85 °C. Ideal for AM/FM demodulation applications, it has a supply voltage range from 1.5V to 6V and max current draw of 18 mA.

Median Price

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Lifecycle Status

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12

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1k+

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Digiode

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Vyrian

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Anansix

USA . 1,464 parts In-Stock

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ECAB

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Resion

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ACDS - Activité Composants Distribution Service

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LittleDiode

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LWI Electronics Inc

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Corel Iberica Componentes, S.L.

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Fibra_Brandt Electronic GMBH

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Huijzer Components

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IDEA Electronic Components Group

UK . 2,343 parts In-Stock

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MKK Technologies

India . 654 parts In-Stock

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DigiPath Technology Company

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Parana Technologies

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Cyclops Electronics Ltd (Excess)

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Overview

Unleash the power of audio demodulation with the TDA7220 by STMicroelectronics. Crafted with precision and quality, this receiver IC offers unrivaled performance in a compact rectangular package. Perfect for applications requiring high signal-to-noise ratios, low harmonic distortion, and reliable demodulation of AM and FM signals. Experience the seamless integration and exceptional value that STMicroelectronics provides, setting new standards in audio processing technology. Elevate your audio projects with the TDA7220 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This makes the product lightweight and durable, which is ideal for portable devices.

General IC Type: AUDIO DEMODULATOR

Perfect for applications requiring audio demodulation, providing clear sound quality.

Harmonic Distortion: 1.1 %

Low distortion ensures high-quality audio output with minimal interference.

No. of Terminals: 16

Provides flexibility for connecting to various external components in the circuit.

Maximum Operating Temperature: 85 °C

Can operate efficiently even in high-temperature environments.

Nominal Signal to Noise Ratio (FM): 65 dB

Delivers clear and crisp FM audio signals with minimal background noise.

Minimum Supply Voltage (Vsup): 1.5 V

Can operate at low voltage levels, making it energy-efficient.

Demodulation Type: AM/FM

Supports both AM and FM demodulation, providing versatility in signal reception.

Maximum Supply Current: 18 mA

Operates with low current consumption, reducing power usage.

Nominal Output Voltage (FM): 70 mV

Provides a suitable output voltage level for audio signals in FM demodulation.

Technical Specifications

Receiver ICs TDA7220 attributes and parameters. Explore more Receiver ICs devices from STMicroelectronics

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

1.1 %

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Nominal Output Voltage (AM):

80 mV

Nominal Output Voltage (FM):

70 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Nominal Signal to Noise Ratio (FM):

65 dB

Maximum Supply Current:

18 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1.5 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

TDA7220 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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