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TDA7513T

STMicroelectronics

TDA7513T by STMicroelectronics

TDA7513T by STMicroelectronics is a low-profile audio single-chip receiver with a 66 dB SNR and 3% harmonic distortion. It features an 80-terminal gull-wing package, ideal for compact applications. This versatile IC supports AM/FM demodulation for high-quality audio reception.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,211 parts In-Stock

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Digiode

USA . 3,708 parts In-Stock

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3,708

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Anansix

USA . 2,195 parts In-Stock

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2,195

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IDEA Electronic Components Group

UK . 1,159 parts In-Stock

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$3.309

100+ parts

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$2.978

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1,159

$3.309

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$2.978

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MKK Technologies

India . 387 parts In-Stock

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$6.223

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387

$6.223

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DigiPath Technology Company

USA . 387 parts In-Stock

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$6.223

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387

$6.223

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A-Z Elektronik GmbH

Germany . 4,938 parts In-Stock

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4,938

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Corphita

USA . 3,671 parts In-Stock

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Kepictronics

USA . 1,890 parts In-Stock

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Parana Technologies

USA . 1,006 parts In-Stock

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$3.957

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$3.957

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Perfect Parts

USA . 560 parts In-Stock

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Overview

Unlock the power of high-quality audio with the TDA7513T from STMicroelectronics, a leader in innovative semiconductor solutions. This sleek, low-profile receiver IC excels in delivering crystal-clear sound, making it perfect for applications ranging from automotive systems to home entertainment. With its robust design and proven reliability, customers enjoy unmatched performance, reduced distortion, and enhanced listening experiences. Elevate your projects with ST's trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing a durable plastic/epoxy material ensures reliability and protection against environmental factors, enhancing the product's longevity.

Surface Mount: YES

The surface mount capability allows for compact design and efficient space use on printed circuit boards, making it ideal for modern electronics.

Package Shape: SQUARE

The square shape facilitates uniform heat distribution and integration into various layouts, enhancing compatibility with different designs.

General IC Type: AUDIO SINGLE CHIP RECEIVER

Specialized as an audio single chip receiver, this IC is specifically designed to handle audio signals effectively, ensuring high performance in audio applications.

Harmonic Distortion: 3 %

Low harmonic distortion means clearer sound reproduction, which is essential for high-fidelity audio applications, making this receiver a solid choice for audio enthusiasts.

No. of Terminals: 80

With 80 terminals, this IC offers extensive connectivity options, allowing for versatile configuration and integration into complex systems.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile design helps save space and is suitable for compact devices, which is important for modern electronic design.

Terminal Finish: NICKEL PALLADIUM GOLD

Premium terminal finish enhances conductivity and minimizes oxidation, leading to better signal integrity and overall performance.

Terminal Position: QUAD

The quad terminal positioning aids in efficient soldering and connection, contributing to reliable device performance.

Maximum Seated Height: 1.6 mm

The low seated height is beneficial for slim designs, accommodating compact spaces and giving designers more flexibility.

Nominal Signal to Noise Ratio (FM): 66 dB

A high signal-to-noise ratio (SNR) ensures better clarity and quality in audio signals, making it suitable for high-performance audio applications.

Width: 14 mm

A compact width allows for versatile usage in small devices while maintaining performance standards, making it suitable for a variety of applications.

Minimum Supply Voltage (Vsup): 8 V

The minimum supply voltage of 8V provides adequate power for efficient operation, allowing compatibility with various power systems.

Length: 14 mm

This standardized length, combined with the width, contributes to a compact footprint, facilitating easier integration into various applications.

Nominal Output Voltage (AM): 266 mV

A nominal AM output voltage of 266 mV indicates effective signal processing, promoting reliable audio performance for AM applications.

Demodulation Type: AM/FM

Support for both AM and FM demodulation expands application compatibility, making it a versatile choice for various audio reception needs.

Nominal Output Voltage (FM): 375 mV

The FM output voltage of 375 mV ensures strong audio performance, vital for clear transmission and reception.

Terminal Form: GULL WING

Gull wing terminals provide robust soldering capability, ensuring a strong connection that enhances reliability in the assembly process.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for high-density packaging in circuit designs, maximizing space efficiency while maintaining performance.

Maximum Supply Voltage (Vsup): 8 V

A maximum supply voltage of 8V ensures safety and efficiency in operation, aligning well with standard electronic design parameters.

Technical Specifications

Receiver ICs TDA7513T attributes and parameters. Explore more Receiver ICs devices from STMicroelectronics

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

3 %

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

14 mm

No. of Functions:

1

No. of Terminals:

80

Nominal Output Voltage (AM):

266 mV

Nominal Output Voltage (FM):

375 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Signal to Noise Ratio (FM):

66 dB

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

TDA7513T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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