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TDA7705

STMicroelectronics

TDA7705 by STMicroelectronics

TDA7705 by STMicroelectronics is a versatile audio/video demodulator in a 64-terminal flatpack package. It features surface mount technology, with a peak reflow temp of 260 °C and moisture sensitivity level 3. Ideal for advanced receiver applications, it ensures reliable performance.

Median Price

$3.849

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 3,000 parts In-Stock

1+ parts

$1.742

100+ parts

$1.585

1k+ parts

$1.428

10k+ parts

-

3,000

$1.742

$1.585

$1.428

-

Arrow

USA . 955 parts In-Stock

1+ parts

$3.448

100+ parts

-

1k+ parts

-

10k+ parts

-

955

$3.448

-

-

-

Chip1Stop

Japan . 955 parts In-Stock

1+ parts

$4.250

100+ parts

-

1k+ parts

-

10k+ parts

-

955

$4.250

-

-

-

DigiKey

USA . 958 parts In-Stock

1+ parts

$8.220

100+ parts

$6.748

1k+ parts

$5.621

10k+ parts

-

958

$8.220

$6.748

$5.621

-

Verical

USA . 955 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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955

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,805 parts In-Stock

1+ parts

$1.655

100+ parts

-

1k+ parts

-

10k+ parts

-

4,805

$1.655

-

-

-

Vyrian

USA . 8,960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,960

-

-

-

-

Cyclops Electronics Ltd

UK . 960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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-

960

-

-

-

-

Anansix

USA . 941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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941

-

-

-

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Prism Electronics

USA . 110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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110

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 798 parts In-Stock

1+ parts

$1.157

100+ parts

-

1k+ parts

$1.042

10k+ parts

-

798

$1.157

-

$1.042

-

Corphita

USA . 654 parts In-Stock

1+ parts

$1.568

100+ parts

-

1k+ parts

-

10k+ parts

-

654

$1.568

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$1.742

100+ parts

$1.585

1k+ parts

$1.428

10k+ parts

-

3,000

$1.742

$1.585

$1.428

-

MKK Technologies

India . 580 parts In-Stock

1+ parts

$2.176

100+ parts

-

1k+ parts

-

10k+ parts

-

580

$2.176

-

-

-

DigiPath Technology Company

USA . 580 parts In-Stock

1+ parts

$2.176

100+ parts

-

1k+ parts

-

10k+ parts

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580

$2.176

-

-

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A-Z Elektronik GmbH

Germany . 7,032 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

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7,032

-

-

-

-

Kepictronics

USA . 4,340 parts In-Stock

1+ parts

-

100+ parts

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4,340

-

-

-

-

RC Electronics

USA . 3,673 parts In-Stock

1+ parts

-

100+ parts

$8.340

1k+ parts

$7.570

10k+ parts

$7.300

3,673

-

$8.340

$7.570

$7.300

Authorized Procurement Solutions

USA . 3,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,200

-

-

-

-

Perfect Parts

USA . 2,264 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,264

-

-

-

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Parana Technologies

USA . 1,522 parts In-Stock

1+ parts

-

100+ parts

$1.384

1k+ parts

-

10k+ parts

-

1,522

-

$1.384

-

-

Infinite Electronics LLP (Excess)

. 666 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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666

-

-

-

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Formix International (Excess)

India . 662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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662

-

-

-

-

Overview

Elevate your audio and video experiences with the TDA7705 from STMicroelectronics, a leader in innovative technology solutions. This cutting-edge receiver IC offers exceptional performance in a compact design, making it perfect for automotive infotainment systems, portable multimedia devices, and smart home applications. With ST’s commitment to quality and reliability, the TDA7705 ensures seamless integration and outstanding sound clarity, delivering unmatched value for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers good durability and protection against environmental factors, ensuring reliability in various application settings.

Surface Mount: YES

Being surface mount compatible allows for efficient use of space on PCBs and enables automated assembly processes, making it suitable for compact designs.

Package Shape: SQUARE

The square package shape is advantageous for efficient heat dissipation and provides a balanced layout on circuit boards for increased performance.

General IC Type: AUDIO/VIDEO DEMODULATOR

Designed specifically for demodulating audio and video signals, this IC is ideal for a wide range of multimedia applications, enhancing overall performance.

No. of Terminals: 64

With 64 terminals, this IC can accommodate a variety of functionalities and connections, allowing for greater flexibility in device design.

Package Style (Meter): FLATPACK

The flatpack style facilitates easy installation in space-constrained applications while maintaining a robust connection integrity.

Terminal Finish: MATTE TIN

Matte tin finish ensures excellent solderability and minimizes oxidation, contributing to long-term reliability and performance of the IC.

Terminal Position: QUAD

Quad terminal positioning enhances contact reliability and simplifies PCB layout, allowing for easier integration into complex circuits.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds indicates that the IC can withstand standard soldering processes without degradation, ensuring high-quality assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this IC is compatible with modern lead-free soldering processes, aligning with industry standards for environmental safety.

Terminal Form: GULL WING

The gull wing terminal design offers greater ease of soldering and enhances mechanical stability, which is critical for maintaining performance over time.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates moderate sensitivity to moisture, making this IC suitable for various manufacturing and storage conditions with proper handling.

Technical Specifications

Receiver ICs TDA7705 attributes and parameters. Explore more Receiver ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

TDA7705 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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