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LM1865M

Texas Instruments

LM1865M by Texas Instruments

LM1865M by Texas Instruments is an audio demodulator IC with FM demodulation type. It offers a low harmonic distortion of 0.15% and a high signal to noise ratio of 84 dB for clear audio output. With a small outline package style, it is ideal for applications requiring precise FM demodulation in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,678 parts In-Stock

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5,678

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Digiode

USA . 3,326 parts In-Stock

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3,326

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Anansix

USA . 2,609 parts In-Stock

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2,609

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Bristol Electronics

USA . 430 parts In-Stock

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430

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Atlantic Semiconductor

USA . 430 parts In-Stock

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430

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Executive Electronics, Inc.

USA . 40 parts In-Stock

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,012 parts In-Stock

1+ parts

$0.395

100+ parts

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1k+ parts

$1.584

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1,012

$0.395

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$1.584

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DigiPath Technology Company

USA . 319 parts In-Stock

1+ parts

$0.435

100+ parts

$0.400

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319

$0.435

$0.400

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ChromeModa Solutions

Germany . 5,458 parts In-Stock

1+ parts

$0.444

100+ parts

$0.364

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5,458

$0.444

$0.364

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IDEA Electronic Components Group

UK . 1,512 parts In-Stock

1+ parts

$0.444

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$0.400

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1,512

$0.444

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$0.400

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AZTECH Wire

Italy . 422 parts In-Stock

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$13.058

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422

$13.058

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One Stop Electronics

USA . 641 parts In-Stock

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$17.800

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641

$17.800

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 2,685 parts In-Stock

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2,685

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Overview

Experience crystal clear audio with the LM1865M Receiver IC from Texas Instruments, a leading manufacturer known for producing high-quality components. Ideal for applications such as audio systems and radios, this small outline package delivers top-notch performance with a harmonic distortion of just 0.15%. With a nominal signal to noise ratio of 84dB, customers can enjoy exceptional sound quality. Trust in Texas Instruments to provide reliable and innovative solutions for all your audio needs. Upgrade your devices with the LM1865M and elevate your listening experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making this product easy to handle and resistant to damage during handling or installation.

Surface Mount: YES

Surface mount capability allows for easy and efficient soldering onto circuit boards, simplifying the assembly process.

Package Shape: RECTANGULAR

Rectangular shape ensures compatibility with standard PCB layouts, making it easier to integrate into existing designs.

General IC Type: AUDIO DEMODULATOR

Audio demodulator type indicates the IC's ability to accurately decode audio signals, ensuring high-quality sound output.

Harmonic Distortion: 0.15 %

Low harmonic distortion ensures clean and accurate audio output, minimizing signal interference for improved sound quality.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options, enabling the IC to interface with a variety of other components.

Package Style (Meter): SMALL OUTLINE

Compact small outline package style saves space on the PCB, making it suitable for applications with limited board space.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -20 °C

Wide temperature range allows for usage in both cold and hot environments without compromising performance.

Terminal Position: DUAL

Dual terminal position offers redundancy and flexibility in circuit connections, reducing the risk of connection failure.

Maximum Seated Height: 2.642 mm

Low seated height profile makes the IC suitable for compact applications where space is limited.

Nominal Signal to Noise Ratio (FM): 84 dB

High signal-to-noise ratio ensures clear reception and playback of FM audio signals with minimal unwanted noise.

Width: 7.493 mm

Narrow width profile allows for efficient use of board space, facilitating compact and streamlined circuit designs.

Minimum Supply Voltage (Vsup): 7.3 V

Low minimum supply voltage requirement enables operation in low-power scenarios, increasing energy efficiency.

Length: 12.8015 mm

Compact length dimensions make the IC suitable for applications with space constraints, without sacrificing functionality.

Demodulation Type: FM

FM demodulation type ensures accurate decoding of frequency modulated signals, maintaining audio integrity and clarity.

Terminal Form: GULL WING

Gull wing terminal form offers secure solder connections and mechanical stability, enhancing the overall reliability of the IC.

Nominal Output Voltage (FM): 320 mV

Optimal output voltage level ensures consistent and reliable performance in delivering FM audio signals to connected devices.

Terminal Pitch: 1.27 mm

Standard terminal pitch simplifies PCB layout and assembly, making it easier to integrate the IC into circuit designs.

Maximum Supply Voltage (Vsup): 16 V

High maximum supply voltage tolerance provides flexibility in power input options, enabling compatibility with a wide range of power sources.

Technical Specifications

Receiver ICs LM1865M attributes and parameters. Explore more Receiver ICs devices from Texas Instruments

Specs

General IC Type:

Demodulation Type:

FM

Harmonic Distortion:

.15 %

JESD-30 Code:

R-PDSO-G20

Length:

12.8015 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Nominal Output Voltage (FM):

320 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

2.642 mm

Nominal Signal to Noise Ratio (FM):

84 dB

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

7.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.493 mm

Trade Compliance

LM1865M General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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