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TEA6100

NXP Semiconductors

TEA6100 by NXP Semiconductors

TEA6100 by NXP Semiconductors is an audio demodulator IC with 20 terminals. It offers AM/FM demodulation, 0.65% harmonic distortion, and operates b/w -30 to 85°C. Ideal for applications requiring a nominal output voltage of 200 mV in a compact rectangular package style.

Median Price

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Lifecycle Status

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12

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Vyrian

USA . 4,811 parts In-Stock

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Digiode

USA . 2,782 parts In-Stock

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Anansix

USA . 1,620 parts In-Stock

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Bristol Electronics

USA . 456 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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ComSIT Distribution GmbH

Germany . 80 parts In-Stock

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LittleDiode

UK . 37 parts In-Stock

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Huijzer Components

Netherlands . 29 parts In-Stock

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ABC Electronics Ltd.

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Cogito LLC

Ukraine . 3 parts In-Stock

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GES GmbH

Germany . 3 parts In-Stock

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Donberg Electronics Ltd

Ireland . 1 parts In-Stock

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Modulus Dynamics

Lithuania . 3,167 parts In-Stock

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$0.435

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Corohmni

South Africa . 876 parts In-Stock

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One Stop Electronics

USA . 350 parts In-Stock

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Ampacity Inc.

Singapore . 656 parts In-Stock

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Argo Parts USA

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UNI Independent Distributors

Spain . 3,375 parts In-Stock

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Corphita

USA . 3,123 parts In-Stock

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Continental Prestige Electronics

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Assy Fe

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Aranea Global

USA . 1,000 parts In-Stock

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Kepictronics

USA . 300 parts In-Stock

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Overview

Elevate your audio experience with the TEA6100 by NXP Semiconductors. Designed with precision and reliability in mind, this receiver IC delivers crystal-clear sound quality for a wide range of applications. Whether you're looking to enhance your home entertainment system or upgrade your car stereo, the TEA6100 offers unmatched performance and value. Trust in NXP Semiconductors' expertise to bring you cutting-edge technology that exceeds expectations. Upgrade your audio experience today with the TEA6100.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are known for their durability and resistance to heat, making this receiver IC reliable for long-term use.

General IC Type: AUDIO DEMODULATOR

An audio demodulator type ensures high-quality sound output, making this receiver IC suitable for audio applications.

Harmonic Distortion: 0.65%

Low harmonic distortion of 0.65% ensures clean and clear audio output, making this receiver IC ideal for audio demodulation.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options, making this receiver IC compatible with a range of systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this receiver IC can withstand high temperature environments, ensuring reliable performance.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature of -30 °C allows this receiver IC to function in cold environments without any issues.

Maximum Supply Voltage (Vsup): 12 V

The maximum supply voltage of 12 V provides flexibility in power supply options, making this receiver IC versatile for different applications.

Technical Specifications

Receiver ICs TEA6100 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

.65 %

JESD-30 Code:

R-PDIP-T20

Length:

26.73 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Nominal Output Voltage (AM):

200 mV

Nominal Output Voltage (FM):

200 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TEA6100 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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