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TDA1597

NXP Semiconductors

TDA1597 by NXP Semiconductors

AUDIO/VIDEO DEMODULATOR; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Shape: RECTANGULAR; Terminal Position: DUAL; Terminal Finish: Matte Tin (Sn);

Median Price

$1.882

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,319 parts In-Stock

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3,319

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ComSIT Distribution GmbH

Germany . 2,223 parts In-Stock

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2,223

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R&J Components

USA . 1,975 parts In-Stock

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1,975

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Vyrian

USA . 1,685 parts In-Stock

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1,685

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Anansix

USA . 339 parts In-Stock

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339

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Bristol Electronics

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$1.882

1k+ parts

$1.747

10k+ parts

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150

-

$1.882

$1.747

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Pegasus Components GmbH

Germany . 94 parts In-Stock

1+ parts

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94

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ACDS - Activité Composants Distribution Service

France . 8 parts In-Stock

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 519 parts In-Stock

1+ parts

$8.800

100+ parts

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519

$8.800

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Corphita

USA . 4,017 parts In-Stock

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4,017

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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UNI Independent Distributors

Spain . 280 parts In-Stock

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280

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Assy Fe

Spain . 3 parts In-Stock

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3

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Technical Specifications

Receiver ICs TDA1597 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e3

No. of Terminals:

18

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

TDA1597 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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