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TDA1220BK

STMicroelectronics

TDA1220BK by STMicroelectronics

TDA1220BK by STMicroelectronics is an audio demodulator IC with 1.2% harmonic distortion, 65 dB SNR for FM signals, and operates b/w -20 °C to 85°C. It has a max supply voltage of 16V and is used in applications requiring AM/FM demodulation with a min supply voltage of 3V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,340 parts In-Stock

1+ parts

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4,340

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Anansix

USA . 1,483 parts In-Stock

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1,483

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Vyrian

USA . 143 parts In-Stock

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143

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 552 parts In-Stock

1+ parts

$1.794

100+ parts

-

1k+ parts

$1.615

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552

$1.794

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$1.615

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MKK Technologies

India . 910 parts In-Stock

1+ parts

$3.374

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910

$3.374

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DigiPath Technology Company

USA . 910 parts In-Stock

1+ parts

$3.374

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910

$3.374

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Corphita

USA . 4,719 parts In-Stock

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4,719

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Parana Technologies

USA . 1,599 parts In-Stock

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$2.145

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1,599

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$2.145

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Overview

Unlock the ultimate audio experience with the TDA1220BK by STMicroelectronics! As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality and reliability. This receiver IC boasts unparalleled performance with its low harmonic distortion and impressive signal-to-noise ratio. Ideal for a wide range of applications, this audio demodulator is a game-changer in the world of electronics. Say goodbye to subpar sound quality and welcome crystal-clear audio with the TDA1220BK. Elevate your listening experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides durability and protection for the internal components of the receiver IC, ensuring a longer lifespan.

Package Shape: RECTANGULAR

The rectangular shape allows for easier integration into circuit designs and makes it easier to align with other components.

General IC Type: AUDIO DEMODULATOR

Being an audio demodulator, this receiver IC is specifically designed for processing audio signals, making it ideal for applications where high-quality audio output is important.

Harmonic Distortion: 1.2 %

With low harmonic distortion, this receiver IC ensures that the output audio signal is clear and free from unwanted noise or interference.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for various input and output connections, allowing for versatile usage in different applications.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to mount the receiver IC on a circuit board, saving space and simplifying the overall design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this receiver IC can withstand elevated temperatures without compromising performance, ensuring reliability in various environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature allows the receiver IC to function effectively even in cold conditions, making it suitable for a wide range of temperature environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and long-term performance.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in circuit board layout and provides redundancy for improved reliability.

Nominal Signal to Noise Ratio (FM): 65 dB

With a high signal to noise ratio, this receiver IC can effectively distinguish between the desired signal and background noise, resulting in clear audio output.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement makes this receiver IC suitable for low-power applications, helping to conserve energy and extend battery life.

Nominal Output Voltage (AM): 130 mV

A high nominal output voltage for AM signals ensures strong audio output, making this receiver IC suitable for applications where a louder audio signal is needed.

Demodulation Type: AM/FM

Supporting both AM and FM demodulation allows this receiver IC to be used in a wide range of audio applications, making it a versatile choice for different signal types.

Terminal Form: THROUGH-HOLE

The through-hole terminal form makes it easy to solder the receiver IC onto a circuit board, providing secure connections and stability in the overall system.

Maximum Supply Current: 20 mA

With a low maximum supply current requirement, this receiver IC helps minimize power consumption, making it suitable for portable and battery-powered devices.

Nominal Output Voltage (FM): 110 mV

A high nominal output voltage for FM signals ensures strong audio output, making this receiver IC suitable for applications where a louder audio signal is needed.

Maximum Supply Voltage (Vsup): 16 V

The high maximum supply voltage rating provides flexibility and compatibility with a wide range of power sources, allowing for versatile integration into different systems.

Technical Specifications

Receiver ICs TDA1220BK attributes and parameters. Explore more Receiver ICs devices from STMicroelectronics

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

1.2 %

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Nominal Output Voltage (AM):

130 mV

Nominal Output Voltage (FM):

110 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Nominal Signal to Noise Ratio (FM):

65 dB

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

TDA1220BK General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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