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LM3361AN

Texas Instruments

LM3361AN by Texas Instruments

LM3361AN by Texas Instruments is an audio single chip receiver with FM demodulation. It operates b/w 0-70°C, with supply voltage range of 2-9V. With 16 terminals in a rectangular package, it's ideal for commercial-grade applications requiring a compact IN-LINE design.

Median Price

$1.663

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,009 parts In-Stock

1+ parts

-

100+ parts

$1.490

1k+ parts

$1.330

10k+ parts

$1.260

8,009

-

$1.490

$1.330

$1.260

DigiKey

USA . 8,009 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.960

10k+ parts

-

8,009

-

-

$1.960

-

Verical

USA . 8,009 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.663

10k+ parts

$1.575

8,009

-

-

$1.663

$1.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,573 parts In-Stock

1+ parts

$1.568

100+ parts

-

1k+ parts

-

10k+ parts

-

1,573

$1.568

-

-

-

Vyrian

USA . 4,822 parts In-Stock

1+ parts

$1.650

100+ parts

-

1k+ parts

-

10k+ parts

-

4,822

$1.650

-

-

-

Bristol Electronics

USA . 650 parts In-Stock

1+ parts

$8.960

100+ parts

$3.882

1k+ parts

$3.674

10k+ parts

-

650

$8.960

$3.882

$3.674

-

American Microsemiconductor Inc.

USA . 2 parts In-Stock

1+ parts

$16.280

100+ parts

-

1k+ parts

-

10k+ parts

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2

$16.280

-

-

-

Anansix

USA . 799 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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799

-

-

-

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Microfarads

USA . 605 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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605

-

-

-

-

Sogenti Electronics

Canada . 574 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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574

-

-

-

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Euro-Tech

UK . 19 parts In-Stock

1+ parts

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19

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R&J Components

USA . 14 parts In-Stock

1+ parts

-

100+ parts

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14

-

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GES GmbH

Germany . 10 parts In-Stock

1+ parts

-

100+ parts

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10

-

-

-

-

Century Electronics Ltd.

USA . 10 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10

-

-

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

1+ parts

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3

-

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LittleDiode

UK . 2 parts In-Stock

1+ parts

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,716 parts In-Stock

1+ parts

$1.485

100+ parts

-

1k+ parts

-

10k+ parts

-

4,716

$1.485

-

-

-

Component Stockers USA

USA . 15,195 parts In-Stock

1+ parts

$1.710

100+ parts

$1.610

1k+ parts

$1.450

10k+ parts

$1.450

15,195

$1.710

$1.610

$1.450

$1.450

Parana Technologies

USA . 27 parts In-Stock

1+ parts

$3.147

100+ parts

-

1k+ parts

$3.667

10k+ parts

-

27

$3.147

-

$3.667

-

DigiPath Technology Company

USA . 808 parts In-Stock

1+ parts

$3.465

100+ parts

-

1k+ parts

-

10k+ parts

-

808

$3.465

-

-

-

ChromeModa Solutions

Germany . 3,183 parts In-Stock

1+ parts

$3.536

100+ parts

$2.900

1k+ parts

-

10k+ parts

-

3,183

$3.536

$2.900

-

-

IDEA Electronic Components Group

UK . 389 parts In-Stock

1+ parts

$3.536

100+ parts

-

1k+ parts

$3.182

10k+ parts

-

389

$3.536

-

$3.182

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QUARKTWIN TECHNOLOGY LTD

USA . 4,200 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,200

-

-

-

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GreenTree Electronics

Israel . 99 parts In-Stock

1+ parts

-

100+ parts

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99

-

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Assy Fe

Spain . 29 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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29

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-

-

Overview

Enhance your audio receiver experience with the LM3361AN by Texas Instruments. Known for their top-quality products, Texas Instruments delivers exceptional performance and reliability in the Receiver ICs category. This versatile single chip receiver offers customers unparalleled value with its ease of use and wide range of applications. Whether you're looking to upgrade your sound system or enhance your communication devices, the LM3361AN provides the perfect solution with its high-quality design and superior functionality. Elevate your audio experience today with this innovative product from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and protection for the internal components of the receiver IC.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy and efficient PCB mounting and integration into electronic devices.

General IC Type: AUDIO SINGLE CHIP RECEIVER

This single chip receiver type simplifies the design and manufacturing process, reducing overall costs and saving valuable board space.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this receiver IC can withstand demanding operating conditions without compromising performance.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage requirement makes this receiver IC suitable for battery-powered applications, increasing versatility.

Demodulation Type: FM

The FM demodulation type ensures high-quality audio reception, making it ideal for audio applications where signal clarity is essential.

Technical Specifications

Receiver ICs LM3361AN attributes and parameters. Explore more Receiver ICs devices from Texas Instruments

Specs

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

R-PDIP-T16

Length:

19.305 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Voltage (FM):

350 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

LM3361AN General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-347-8618, 5962013478618

NIIN

013478618

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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