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TEA5711P

NXP Semiconductors

TEA5711P by NXP Semiconductors

TEA5711P by NXP Semiconductors is a versatile audio single-chip receiver with a harmonic distortion of 0.8% and an SNR of 26 dB. It operates b/w -15 °C to 60 °C, making it ideal for commercial applications. This compact IC features a dual terminal design and supports AM/FM demodulation.

Median Price

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Lifecycle Status

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3

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1k+

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Anansix

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One Stop Electronics

USA . 1,596 parts In-Stock

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Corphita

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Overview

Unlock superior audio quality with the TEA5711P from NXP Semiconductors, a leader in innovative technology solutions. This advanced audio receiver IC delivers exceptional performance, ensuring crystal-clear sound across diverse applications, from automotive to consumer electronics. With its robust design and reliable operation, the TEA5711P enhances your projects while reducing development time and costs, making it the perfect choice for quality-conscious developers seeking competitive advantages. Experience the NXP difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures long-term reliability and protection against environmental factors.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space, making it easier to integrate into various designs.

General IC Type: AUDIO SINGLE CHIP RECEIVER

As a single chip receiver designed for audio, it simplifies design complexity and reduces overall system cost.

Harmonic Distortion: 0.8%

With low harmonic distortion, this IC provides superior audio quality, ensuring clearer sound reproduction.

No. of Terminals: 32

A higher number of terminals allows for greater flexibility in circuit design and connectivity.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line shrink pitch style is ideal for high-density applications, saving space and improving layout.

Maximum Operating Temperature: 60 °C

The ability to operate up to 60 °C enhances reliability in various thermal environments.

Minimum Operating Temperature: -15 °C

With a low minimum temperature, this IC can function reliably in colder conditions, expanding its application range.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

This premium terminal finish improves solderability and enhances reliability over time.

Terminal Position: DUAL

Dual terminal positioning allows for better layout flexibility and ease of connection on PCB.

Maximum Seated Height: 4.7 mm

A low seated height profile is advantageous in designs where space is a premium.

Nominal Signal to Noise Ratio (FM): 26 dB

A good signal-to-noise ratio indicates clear audio reception, making it a solid choice for high-quality audio applications.

Width: 10.16 mm

Compact width makes this IC suitable for space-constrained designs, maintaining performance without occupying excess area.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage allows for energy-efficient designs, making it ideal for battery-operated devices.

Length: 28.95 mm

The length of the IC provides a balanced footprint for various applications while maintaining connectivity.

Nominal Output Voltage (AM): 45 mV

A nominal output voltage for AM ensures compatibility with standard audio processing circuits.

Demodulation Type: AM/FM

Supporting both AM and FM demodulation enables versatile use in audio applications, catering to diverse signal types.

Temperature Grade: COMMERCIAL

Commercial temperature grading indicates suitability for general consumer applications, ensuring reliability under normal operating conditions.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical support and is ideal for hand assembly methods.

Nominal Output Voltage (FM): 65 mV

This output voltage level for FM is conducive for direct interfacing with other audio processing components.

Terminal Pitch: 1.778 mm

A moderately spaced terminal pitch enhances soldering ease and minimizes the risk of bridging during assembly.

Maximum Supply Voltage (Vsup): 12 V

With a maximum supply voltage of 12 V, this IC can accommodate a variety of power supply configurations in different applications.

Technical Specifications

Receiver ICs TEA5711P attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

.8 %

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e3/e4

Length:

28.95 mm

No. of Terminals:

32

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-15 Cel

Nominal Output Voltage (AM):

45 mV

Nominal Output Voltage (FM):

65 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Nominal Signal to Noise Ratio (FM):

26 dB

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

TEA5711P General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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