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TDA9806/V1

NXP Semiconductors

TDA9806/V1 by NXP Semiconductors

VIDEO DISCRIMINATOR; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 32; Package Code: SDIP; Package Shape: RECTANGULAR;

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,099 parts In-Stock

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4,099

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Digiode

USA . 3,925 parts In-Stock

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3,925

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Anansix

USA . 1,697 parts In-Stock

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1,697

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ACDS - Activité Composants Distribution Service

France . 19 parts In-Stock

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19

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Distributors (Availability)

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One Stop Electronics

USA . 465 parts In-Stock

1+ parts

$14.800

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465

$14.800

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Perfect Parts

USA . 21,663 parts In-Stock

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21,663

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Cyclops Electronics Ltd (Excess)

UK . 9,671 parts In-Stock

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9,671

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Corphita

USA . 2,108 parts In-Stock

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2,108

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UNI Independent Distributors

Spain . 848 parts In-Stock

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848

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Technical Specifications

Receiver ICs TDA9806/V1 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

FM

Harmonic Distortion:

.15 %

JESD-30 Code:

R-PDIP-T32

Length:

28.95 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Nominal Output Voltage (FM):

500 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Nominal Signal to Noise Ratio (FM):

60 dB

Maximum Supply Current:

110 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

TDA9806/V1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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