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TEA5594P

NXP Semiconductors

TEA5594P by NXP Semiconductors

TEA5594P by NXP Semiconductors is an audio single-chip receiver with a max operating temp of 85 °C and a min supply voltage of 2.7V. It features low harmonic distortion at 0.8% and supports AM/FM demodulation. Ideal for industrial audio applications, it comes in a compact rectangular package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,477 parts In-Stock

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2,477

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Digiode

USA . 458 parts In-Stock

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458

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Anansix

USA . 149 parts In-Stock

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149

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One Stop Electronics

USA . 1,378 parts In-Stock

1+ parts

$15.800

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1,378

$15.800

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UNI Independent Distributors

Spain . 7,955 parts In-Stock

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7,955

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Corphita

USA . 1,006 parts In-Stock

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1,006

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Overview

Experience superior audio performance with the TEA5594P from NXP Semiconductors—a trusted leader in innovative semiconductor solutions. This versatile audio receiver IC is engineered to deliver exceptional sound quality across a range of applications, including communication systems and consumer electronics. With its robust design, temperature resilience, and low distortion, the TEA5594P ensures reliability and efficiency, enhancing your product’s value and user satisfaction. Elevate your audio projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection from environmental factors, ensuring the longevity of the component.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for efficient layout and integration into various designs.

General IC Type: AUDIO SINGLE CHIP RECEIVER

As an audio single chip receiver, this component simplifies circuit design and reduces the number of necessary parts, promoting a compact design.

Harmonic Distortion: 0.8%

Low harmonic distortion ensures high audio fidelity, making this receiver ideal for high-quality audio applications.

No. of Terminals: 32

Having 32 terminals allows for versatile connectivity options, facilitating easier integration into complex systems.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch package style enables more compact designs, which are essential in space-constrained applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this component is suitable for industrial and high-temperature environments.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme conditions, making it ideal for outdoor and industrial applications.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

This terminal finish enhances solderability and corrosion resistance, contributing to reliable long-term performance.

Terminal Position: DUAL

Dual terminal positioning allows for flexible circuit configurations, supporting various mounting methods.

Maximum Seated Height: 4.7 mm

The low profile design minimizes space occupation on the PCB, enabling more components to fit within the same area.

Width: 10.16 mm

A compact width contributes to a smaller overall footprint, which is critical in dense electronic assemblies.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage allows for use in battery-powered applications, enhancing versatility and energy efficiency.

Length: 28.95 mm

An elongated design helps achieve better performance characteristics while fitting well within standard PCB layouts.

Nominal Output Voltage (AM): 50 mV

A nominal output voltage tailored for AM reception indicates compatibility with many audio applications, ensuring adequate signal strength.

Demodulation Type: AM/FM

Support for both AM and FM demodulation makes this receiver versatile for various communication applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures this product meets the rigorous demands of industrial environments.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure strong mechanical support and reliable solder joints, enhancing durability in demanding applications.

Nominal Output Voltage (FM): 90 mV

A robust nominal output voltage for FM enhances the performance and quality of audio signal reception.

Terminal Pitch: 1.778 mm

A standard terminal pitch facilitates compatibility with common PCB layouts, simplifying the design and manufacturing processes.

Maximum Supply Voltage (Vsup): 15 V

The capability to operate at a maximum supply voltage of 15 V allows for flexibility in power supply options across various systems.

Technical Specifications

Receiver ICs TEA5594P attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

.8 %

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e3/e4

Length:

28.95 mm

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (AM):

50 mV

Nominal Output Voltage (FM):

90 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

TEA5594P General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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