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TEA5767HL

NXP Semiconductors

TEA5767HL by NXP Semiconductors

TEA5767HL by NXP Semiconductors is an audio single chip receiver with FM demodulation. It features low harmonic distortion of 0.5%, operates b/w -10 to 75°C, and requires a supply voltage of 2.5-5V. Ideal for applications requiring compact design and high-quality audio reception in commercial electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,266 parts In-Stock

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2,266

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Vyrian

USA . 1,550 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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1,000

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Digiode

USA . 747 parts In-Stock

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747

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ComSIT Distribution GmbH

Germany . 80 parts In-Stock

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80

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Distributors (Availability)

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AZTECH Wire

Italy . 431 parts In-Stock

1+ parts

$5.694

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431

$5.694

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Ampacity Inc.

Singapore . 1,433 parts In-Stock

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$7.800

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One Stop Electronics

USA . 1,033 parts In-Stock

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$21.800

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$21.800

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Continental Prestige Electronics

USA . 3,952 parts In-Stock

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UNI Independent Distributors

Spain . 2,586 parts In-Stock

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Corphita

USA . 1,103 parts In-Stock

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Kepictronics

USA . 520 parts In-Stock

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520

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Argo Parts USA

USA . 276 parts In-Stock

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276

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Assy Fe

Spain . 10 parts In-Stock

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Overview

Unlock the power of crystal-clear audio with the TEA5767HL by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-quality Receiver ICs that are perfect for various applications. This innovative product offers customers unmatched value, superior performance, and reliable functionality. Elevate your audio experience with the TEA5767HL and enjoy the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product durable and cost-effective.

Surface Mount: YES

This feature allows for easy integration into circuit boards, saving time and effort during installation.

Package Shape: SQUARE

The square package shape provides a compact design, saving valuable space in electronic devices.

General IC Type: AUDIO SINGLE CHIP RECEIVER

This specialized design ensures high-quality audio reception and processing in one convenient chip.

Harmonic Distortion: 0.5%

With low harmonic distortion, this product delivers clear and accurate audio signals for enhanced sound quality.

No. of Terminals: 32

The abundance of terminals allows for versatile connectivity options and customization in circuit design.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile package style offers a sleek and space-saving solution for integration in various electronic devices.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature ensures reliable performance even in challenging environments.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature range allows for use in a wide range of climates and conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and a stable electrical connection for long-lasting performance.

Terminal Position: QUAD

The quad terminal position facilitates easier soldering and overall assembly of the product.

Maximum Seated Height: 1.6 mm

The low maximum seated height enables a slim profile for the product, ideal for compact electronic devices.

Width: 7 mm

The small width dimension allows for easy fitting and placement in tight spaces within electronic circuits.

Minimum Supply Voltage (Vsup): 2.5 V

The low minimum supply voltage requirement makes this product energy-efficient and suitable for low-power applications.

Length: 7 mm

The short length of the product enhances its versatility and compatibility with various electronic devices.

Demodulation Type: FM

The FM demodulation type ensures compatibility with a wide range of audio signals for enhanced functionality.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade makes this product suitable for a broad range of commercial applications.

Terminal Form: GULL WING

The gull wing terminal form enhances solder joint reliability and mechanical strength for robust performance.

Nominal Output Voltage (FM): 75 mV

The nominal output voltage of 75 mV ensures a strong and consistent output signal for reliable audio reception.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for precise and compact placement of terminals on the product.

Maximum Supply Voltage (Vsup): 5 V

The high maximum supply voltage capability provides flexibility and compatibility with various power sources.

Technical Specifications

Receiver ICs TEA5767HL attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

FM

Harmonic Distortion:

.5 %

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-10 Cel

Nominal Output Voltage (FM):

75 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

TEA5767HL General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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