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E-TDA7513T

STMicroelectronics

E-TDA7513T by STMicroelectronics

E-TDA7513T by STMicroelectronics is a compact audio single-chip receiver designed for AM/FM applications. It features a low harmonic distortion of 3%, a signal-to-noise ratio of 66 dB, and comes in a flatpack package measuring 14x14 mm. Ideal for space-constrained designs, it ensures high-quality audio performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,535 parts In-Stock

1+ parts

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4,535

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Vyrian

USA . 3,736 parts In-Stock

1+ parts

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3,736

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Anansix

USA . 794 parts In-Stock

1+ parts

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794

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 999 parts In-Stock

1+ parts

$0.238

100+ parts

-

1k+ parts

$0.214

10k+ parts

-

999

$0.238

-

$0.214

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MKK Technologies

India . 1,099 parts In-Stock

1+ parts

$0.448

100+ parts

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1,099

$0.448

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DigiPath Technology Company

USA . 1,099 parts In-Stock

1+ parts

$0.448

100+ parts

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1,099

$0.448

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Native Components

USA . 26 parts In-Stock

1+ parts

$67.310

100+ parts

-

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10k+ parts

$64.618

26

$67.310

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-

$64.618

Northwest PG Solutions

USA . 1,971 parts In-Stock

1+ parts

$74.041

100+ parts

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1,971

$74.041

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Parana Technologies

USA . 1,834 parts In-Stock

1+ parts

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100+ parts

$0.285

1k+ parts

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1,834

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$0.285

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Corphita

USA . 134 parts In-Stock

1+ parts

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134

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Overview

Elevate your audio experience with the E-TDA7513T from STMicroelectronics, a leader in innovative semiconductor solutions. This sleek, low-profile receiver IC delivers outstanding sound quality and reliable performance, making it perfect for diverse applications in consumer electronics, automotive systems, and multimedia devices. With easy integration and superior signal clarity, the E-TDA7513T ensures your projects stand out, offering unmatched value and efficiency that you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for a more compact design, facilitating easier integration into modern electronic devices.

Package Shape: SQUARE

The square package shape is optimal for efficient use of PCB space, enhancing the design flexibility.

General IC Type: AUDIO SINGLE CHIP RECEIVER

As a single-chip receiver, this product simplifies audio system design by integrating key functions into one component.

Harmonic Distortion: 3 %

A low harmonic distortion level ensures high fidelity audio playback, making it a favorable choice for quality audio applications.

No. of Terminals: 80

With 80 terminals, this IC offers a wide range of connectivity options, providing versatility in circuit design.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design is ideal for applications with space constraints, allowing for a sleeker final product.

Terminal Position: QUAD

Quad terminal positioning enhances signal integrity and reduces cross-talk, improving overall performance.

Maximum Seated Height: 1.6 mm

The low maximum seated height helps in reducing the overall profile of the device, which can be crucial for portable applications.

Nominal Signal to Noise Ratio (FM): 66 dB

A high signal-to-noise ratio results in clearer audio output, enhancing user experience in audio reception.

Width: 14 mm

Compact width contributes to space efficiency on printed circuit boards, allowing for more components in a smaller area.

Length: 14 mm

The length complements the width, maintaining a square form factor that optimizes layout and installation.

Nominal Output Voltage (AM): 266 mV

The specific output voltage for AM reception indicates compatibility with various audio devices and amplifiers.

Demodulation Type: AM/FM

Support for both AM and FM demodulation makes this IC versatile for a wide range of audio applications.

Nominal Output Voltage (FM): 375 mV

The higher output voltage for FM reception improves interface with downstream audio processing equipment.

Terminal Form: GULL WING

Gull-wing terminals provide better soldering reliability, ensuring a stronger connection to the PCB.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for higher density interconnections, maximizing the performance of compact designs.

Technical Specifications

Receiver ICs E-TDA7513T attributes and parameters. Explore more Receiver ICs devices from STMicroelectronics

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

3 %

JESD-30 Code:

S-PQFP-G80

Length:

14 mm

No. of Functions:

1

No. of Terminals:

80

Nominal Output Voltage (AM):

266 mV

Nominal Output Voltage (FM):

375 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Signal to Noise Ratio (FM):

66 dB

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

E-TDA7513T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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