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E-TDA7512

STMicroelectronics

E-TDA7512 by STMicroelectronics

E-TDA7512 by STMicroelectronics is a low-profile audio single-chip receiver with 1% harmonic distortion, operating b/w -40 °C to 85°C. It features a compact 10mm x 10mm square package and supports AM/FM demodulation. Ideal for industrial applications, it ensures reliable performance in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,055 parts In-Stock

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3,055

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Anansix

USA . 1,787 parts In-Stock

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1,787

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Vyrian

USA . 1,495 parts In-Stock

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1,495

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LWI Electronics Inc

India . 12 parts In-Stock

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12

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IDEA Electronic Components Group

UK . 1,269 parts In-Stock

1+ parts

$0.976

100+ parts

-

1k+ parts

$0.879

10k+ parts

-

1,269

$0.976

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$0.879

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MKK Technologies

India . 340 parts In-Stock

1+ parts

$1.836

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340

$1.836

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DigiPath Technology Company

USA . 340 parts In-Stock

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$1.836

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340

$1.836

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A-Z Elektronik GmbH

Germany . 7,127 parts In-Stock

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7,127

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Alle Elektronik GmbH

Germany . 4,751 parts In-Stock

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4,751

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Corphita

USA . 3,921 parts In-Stock

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3,921

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Parana Technologies

USA . 1,969 parts In-Stock

1+ parts

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$1.167

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1,969

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$1.167

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Kepictronics

USA . 1,704 parts In-Stock

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1,704

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Northwest PG Solutions

USA . 1,006 parts In-Stock

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1,006

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Native Components

USA . 988 parts In-Stock

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988

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Overview

Unlock unparalleled audio performance with the E-TDA7512 from STMicroelectronics, a leader in innovative semiconductor solutions. This compact, low-profile receiver IC delivers remarkable sound quality and reliability across diverse applications, from automotive systems to consumer electronics. With its robust design and minimal distortion, customers can enjoy superior audio experiences while benefiting from STMicroelectronics' commitment to excellence and industry expertise. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and electrical insulation, making the receiver IC reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern circuits, enhancing manufacturing efficiency.

Package Shape: SQUARE

The square shape optimizes space on printed circuit boards (PCBs), allowing for a more efficient layout.

General IC Type: AUDIO SINGLE CHIP RECEIVER

Designed specifically for audio applications, this chip simplifies audio processing and improves system integration.

Harmonic Distortion: 1%

Low harmonic distortion ensures high audio fidelity, making it ideal for high-quality audio systems.

No. of Terminals: 64

A higher number of terminals allows for more connections, enabling complex functionalities within the IC.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile design helps in saving space and provides ease of placement on PCBs in compact devices.

Maximum Operating Temperature: 85 °C

The IC can operate in high-temperature environments, making it suitable for industrial and rugged applications.

Minimum Operating Temperature: -40 °C

This temperature range ensures reliable performance in extreme conditions, suitable for outdoor and automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish enhances conductivity and provides excellent corrosion resistance, ensuring longevity in diverse environments.

Terminal Position: QUAD

Quad terminal positioning allows for versatile layout options and better signal integrity.

Maximum Seated Height: 1.6 mm

A low seated height helps in fitting within tight spaces and contributes to a slim profile in final products.

Width: 10 mm

Standard width allows easy integration and compatibility with various PCB designs.

Minimum Supply Voltage (Vsup): 7.5 V

This voltage requirement allows for flexible power supply options in various applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum reflow time ensures reliable soldering during manufacturing, reducing defects.

Peak Reflow Temperature °C: 260

High reflow temperature compatibility suggests robustness in assembly processes, ensuring reliable manufacturing.

Length: 10 mm

This standard length facilitates efficient space management on PCBs, contributing to compact device designs.

Demodulation Type: AM/FM

Support for both AM and FM demodulation makes this IC versatile for various audio applications and systems.

Temperature Grade: INDUSTRIAL

Industrial-grade components ensure reliability and performance in harsh environments typically found in industrial applications.

Technology: BICMOS

BICMOS technology combines the benefits of bipolar and CMOS technologies, offering high-speed performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminals ease the soldering process, contributing to higher quality connections and assembly efficiency.

Terminal Pitch: 0.5 mm

Fine pitch allows for denser packaging of components, thus saving board space and supporting advanced designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates a reasonable level of sensitivity to moisture, guiding storage and handling practices to ensure reliability.

Maximum Supply Voltage (Vsup): 10 V

The capability to operate at a maximum of 10 V allows compatibility with a range of power supply options while ensuring robust performance.

Technical Specifications

Receiver ICs E-TDA7512 attributes and parameters. Explore more Receiver ICs devices from STMicroelectronics

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

1 %

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

E-TDA7512 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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