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LA1823

Onsemi

LA1823 by Onsemi

LA1823 by Onsemi is an audio single chip receiver with 0.5% harmonic distortion. It operates b/w -20 to 70 °C and has a nominal SNR of 72 dB for FM signals. This IC, in a rectangular package style, is ideal for AM/FM demodulation applications.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 1,753 parts In-Stock

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Digiode

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Executive Electronics, Inc.

USA . 100 parts In-Stock

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Kepictronics

USA . 5,700 parts In-Stock

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Metaverse IC Inc.

Canada . 5,700 parts In-Stock

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Kulean Microsystems

USA . 5,078 parts In-Stock

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SupplyDigital Components

Austria . 4,109 parts In-Stock

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TANS Electronics

Latvia . 1,914 parts In-Stock

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Problanco Electronics

Mexico . 1,239 parts In-Stock

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Corphita

USA . 1,087 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 323 parts In-Stock

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Corohmni

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Overview

Enhance your audio experience with the LA1823 Receiver IC from Onsemi. Crafted with precision and expertise, this single chip receiver offers unparalleled quality and performance. Ideal for a wide range of applications, this versatile IC delivers crystal-clear sound with minimal distortion. With a compact design and user-friendly features, the LA1823 is a must-have for audio enthusiasts looking for superior sound quality. Upgrade your audio system today and discover the exceptional value and benefits that Onsemi's LA1823 has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the receiver IC lightweight and durable, making it suitable for various applications.

General IC Type: AUDIO SINGLE CHIP RECEIVER

The integration of audio functionality into a single chip simplifies circuit design and saves space, making it a cost-effective solution for audio applications.

Harmonic Distortion: 0.5 %

The low harmonic distortion of only 0.5% ensures high-quality audio output with minimal signal interference.

No. of Terminals: 24

The 24 terminals provide versatile connectivity options and potential for various input and output configurations.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C allows the receiver IC to operate efficiently in a wide range of environments.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20 °C ensures reliable performance even in extreme cold conditions.

Nominal Output Voltage (FM): 165 mV

The nominal output voltage of 165 mV for FM signals ensures strong and clear audio output.

Demodulation Type: AM/FM

Support for both AM and FM demodulation allows the receiver IC to capture and process a wide range of radio signals.

Maximum Supply Voltage (Vsup): 6 V

The high maximum supply voltage of 6V provides flexibility in power supply options and compatibility with various systems.

Technical Specifications

Receiver ICs LA1823 attributes and parameters. Explore more Receiver ICs devices from Onsemi

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

.5 %

JESD-30 Code:

R-PDIP-T24

Length:

21 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Nominal Output Voltage (AM):

75 mV

Nominal Output Voltage (FM):

165 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

3.9 mm

Nominal Signal to Noise Ratio (FM):

72 dB

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

LA1823 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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