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LA75520K

Onsemi

LA75520K by Onsemi

LA75520K by Onsemi is an audio/video demodulator IC with 24 terminals in an in-line package. Operating temperature range of -20 to 70 °C, power supply of 5V, and plastic/epoxy body material make it ideal for commercial applications requiring reliable signal reception and processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,374 parts In-Stock

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2,374

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Digiode

USA . 1,008 parts In-Stock

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1,008

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 7,818 parts In-Stock

1+ parts

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7,818

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TANS Electronics

Latvia . 5,524 parts In-Stock

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5,524

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Problanco Electronics

Mexico . 2,975 parts In-Stock

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2,975

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Corphita

USA . 2,034 parts In-Stock

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2,034

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SupplyDigital Components

Austria . 1,079 parts In-Stock

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1,079

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UHIMA Technologies

Türkiye . 907 parts In-Stock

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907

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Corohmni

South Africa . 67 parts In-Stock

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67

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Overview

Unlock a world of crystal-clear audio and video with the LA75520K by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality receiver ICs that guarantee exceptional performance and reliability. Whether you're designing a television, DVD player, or multimedia system, this audio/video demodulator is the perfect solution. With a package style that's both durable and compact, the LA75520K offers unparalleled value and convenience for all your electronic projects. Experience the difference with Onsemi - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the internal components of the Receiver IC, making it suitable for long-term use.

General IC Type: AUDIO/VIDEO DEMODULATOR

The AUDIO/VIDEO DEMODULATOR functionality allows the Receiver IC to efficiently process audio and video signals, providing high-quality output.

Power Supplies (V): 5

Operating at 5V ensures compatibility with a wide range of systems and devices, making it versatile and easy to integrate.

Package Style (Meter): IN-LINE

The IN-LINE package style allows for easy installation and space-saving design, making it convenient for a variety of applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this Receiver IC can reliably function in a range of environmental conditions without overheating.

Minimum Operating Temperature: -20 °C

The -20 °C minimum operating temperature ensures that the Receiver IC remains functional even in colder environments, increasing its versatility.

Temperature Grade: COMMERCIAL

The COMMERCIAL temperature grade indicates that this Receiver IC is suitable for standard commercial applications, providing reliable performance in typical operating conditions.

Terminal Form: THROUGH-HOLE

The THROUGH-HOLE terminal form simplifies the installation process and provides secure connections, ensuring stability and reliability in the circuit.

Terminal Pitch: 2.54 mm

Having a terminal pitch of 2.54mm enables easy connection to other components or circuit boards, facilitating quick and efficient integration of the Receiver IC.

Technical Specifications

Receiver ICs LA75520K attributes and parameters. Explore more Receiver ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T24

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

LA75520K General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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