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LA75503V

Onsemi

LA75503V by Onsemi

LA75503V by Onsemi is a 30-terminal audio/video demodulator IC with 5V power supply. Operating temperature range from -20 to 70 °C, it's ideal for commercial applications requiring bipolar technology. This surface-mount receiver IC in small outline package is designed for audio/video signal processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 305 parts In-Stock

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Digiode

USA . 102 parts In-Stock

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102

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Kulean Microsystems

USA . 5,396 parts In-Stock

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SupplyDigital Components

Austria . 4,591 parts In-Stock

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Problanco Electronics

Mexico . 3,005 parts In-Stock

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TANS Electronics

Latvia . 1,510 parts In-Stock

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Corphita

USA . 776 parts In-Stock

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UHIMA Technologies

Türkiye . 733 parts In-Stock

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733

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Corohmni

South Africa . 254 parts In-Stock

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Overview

Unlock the power of high-quality audio and video demodulation with the LA75503V by Onsemi. Designed for optimal performance, this receiver IC delivers crystal-clear sound and sharp visuals for a truly immersive experience. With Onsemi's reputation for excellence in manufacturing, you can trust that this product is built to last. Ideal for a wide range of applications, from home entertainment systems to automotive electronics, the LA75503V offers unbeatable value, benefits, and advantages that will elevate your audio/video experience to the next level. Elevate your entertainment today with the LA75503V.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Package Shape: RECTANGULAR

Rectangular shape of the package provides a compact design, ideal for space-constrained applications.

General IC Type: AUDIO/VIDEO DEMODULATOR

The audio/video demodulator function allows for seamless integration into audio/video systems, providing high-quality demodulation.

Power Supplies (V): 5

Operating at 5V makes the product compatible with common power sources, ensuring easy integration into various systems.

No. of Terminals: 30

Having 30 terminals provides flexibility for interfacing with other components, enabling versatile connectivity options.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space on the PCB, allowing for more components to be incorporated in a compact design.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70 °C ensures stable performance under varying environmental conditions.

Minimum Operating Temperature: -20 °C

Operating at a minimum temperature of -20 °C allows for use in colder environments without compromising functionality.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved electrical connection, increasing reliability in operation.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures stable performance in standard operating conditions, suitable for commercial applications.

Technology: BIPOLAR

Bipolar technology offers high performance and efficiency, making the product suitable for demanding audio/video applications.

Terminal Form: GULL WING

Gull wing terminal form offers easy soldering and secure connection to the PCB, enhancing the overall reliability of the product.

Maximum Supply Current: 73.6 mA

With a maximum supply current of 73.6 mA, the product operates efficiently while minimizing power consumption.

Terminal Pitch: 0.635 mm

Having a terminal pitch of 0.635 mm allows for precise and compact placement on the PCB, enabling high-density integration.

Technical Specifications

Receiver ICs LA75503V attributes and parameters. Explore more Receiver ICs devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G30

No. of Terminals:

30

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP30,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

73.6 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LA75503V General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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