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SA605DK,112

NXP Semiconductors

SA605DK,112 by NXP Semiconductors

SA605DK,112 by NXP Semiconductors is an audio single chip receiver with a package style of small outline, low profile, and shrink pitch. It operates in industrial temperature grade and has a max supply voltage of 8V. This receiver IC is commonly used in applications such as FM demodulation for audio systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,019 parts In-Stock

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Digiode

USA . 3,316 parts In-Stock

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Anansix

USA . 2,708 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Ampacity Inc.

Singapore . 1,150 parts In-Stock

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$4.800

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$4.800

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One Stop Electronics

USA . 854 parts In-Stock

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$4.800

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854

$4.800

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AZTECH Wire

Italy . 497 parts In-Stock

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$12.106

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Corphita

USA . 4,883 parts In-Stock

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UNI Independent Distributors

Spain . 4,019 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Perfect Parts

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GreenTree Electronics

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Overview

Experience the ultimate in audio performance with the SA605DK,112 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors is renowned for their top-quality products that deliver exceptional results. The SA605DK,112 receiver IC is no exception. Its compact design, surface mount capability, and wide temperature range make it perfect for various applications. With its advanced FM demodulation technology and impressive signal-to-noise ratio of 73 dB, this audio single chip receiver ensures crystal-clear sound reproduction. Whether you're designing audio systems for industrial or consumer electronics, the SA605DK,112 offers unbeatable value, benefits, and advantages. Trust NXP Semiconductors for the highest quality solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and cost-effectiveness for the product.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

General IC Type: AUDIO SINGLE CHIP RECEIVER

The audio single chip receiver design offers a compact and efficient solution for audio signal reception.

Nominal Signal to Noise Ratio (FM): 73 dB

High signal to noise ratio ensures clear and crisp audio reception, enhancing overall user experience.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality even in colder climates.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Maximum Seated Height: 1.5 mm

Low seated height saves space in compact electronic devices.

Nominal Output Voltage (FM): 150 mV

The nominal output voltage ensures adequate signal strength for audio output.

Technical Specifications

Receiver ICs SA605DK,112 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

Additional Features:

IN-BUILT QUADRATURE DETECTOR

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (FM):

150 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Nominal Signal to Noise Ratio (FM):

73 dB

Maximum Supply Current:

6.55 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

SA605DK,112 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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