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SA604AD/01,112

NXP Semiconductors

SA604AD/01,112 by NXP Semiconductors

SA604AD/01,112 by NXP Semiconductors is an audio demodulator IC with 16 terminals. It operates b/w -40 to 85 °C and offers a signal-to-noise ratio of 73 dB for FM demodulation. This small outline package is ideal for industrial applications requiring high-quality audio processing.

Median Price

$8.420

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 5,000 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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$7.840

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Bristol Electronics

USA . 12 parts In-Stock

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$9.000

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Vyrian

USA . 8,552 parts In-Stock

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Anansix

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Digiode

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Modulus Dynamics

Lithuania . 3,511 parts In-Stock

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$2.540

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$2.540

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$2.540

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Aztec Data Supply Inc.

USA . 3,024 parts In-Stock

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$3.360

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Ampacity Inc.

Singapore . 4,996 parts In-Stock

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$6.800

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Continental Prestige Electronics

USA . 6,892 parts In-Stock

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$7.840

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Netroflash

USA . 1,000 parts In-Stock

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$7.840

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$7.448

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AZTECH Wire

Italy . 238 parts In-Stock

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$15.990

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Semicontronic

India . 14,203 parts In-Stock

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$18.800

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$18.330

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QUARKTWIN TECHNOLOGY LTD

USA . 20,030 parts In-Stock

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Lixinc

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Microchip USA

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Argo Parts USA

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Perfect Parts

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Corphita

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Corohmni

South Africa . 660 parts In-Stock

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UNI Independent Distributors

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Overview

Elevate your audio experience with the SA604AD/01,112 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-notch quality and reliability in receiver ICs. Ideal for applications requiring high-performance audio demodulation, this product offers exceptional value with its advanced features and benefits. Whether you're looking to enhance your sound system or improve communication devices, the SA604AD/01,112 provides unmatched advantages that cater to your needs. Trust NXP Semiconductors to deliver excellence in every aspect of your audio solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and cost-effective.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

General IC Type: AUDIO DEMODULATOR

Specifically designed for audio demodulation applications, ensuring high performance in audio processing.

Maximum Operating Temperature: 85 °C

High maximum operating temperature makes this IC suitable for industrial applications where heat resistance is important.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement allows for flexibility in power source selection.

Technical Specifications

Receiver ICs SA604AD/01,112 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (FM):

530 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Signal to Noise Ratio (FM):

73 dB

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

SA604AD/01,112 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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