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SA605D/01,112

NXP Semiconductors

SA605D/01,112 by NXP Semiconductors

AUDIO SINGLE CHIP RECEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$4.410

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,557 parts In-Stock

1+ parts

$2.930

100+ parts

$2.870

1k+ parts

$2.810

10k+ parts

-

3,557

$2.930

$2.870

$2.810

-

Newark

USA . 747 parts In-Stock

1+ parts

$5.890

100+ parts

$4.340

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747

$5.890

$4.340

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,711 parts In-Stock

1+ parts

$2.784

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1,711

$2.784

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Bristol Electronics

USA . 4 parts In-Stock

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$6.720

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4

$6.720

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Vyrian

USA . 3,963 parts In-Stock

1+ parts

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3,963

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Flip Electronics

USA . 990 parts In-Stock

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990

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Anansix

USA . 327 parts In-Stock

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327

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Rebound Electronics

UK . 72 parts In-Stock

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72

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Inventory MP

USA . 45 parts In-Stock

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45

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Ashlea Components Ltd

UK . 20 parts In-Stock

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20

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Microfarads

USA . 17 parts In-Stock

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17

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 245 parts In-Stock

1+ parts

$2.637

100+ parts

-

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245

$2.637

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Continental Prestige Electronics

USA . 830 parts In-Stock

1+ parts

$4.720

100+ parts

$2.830

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830

$4.720

$2.830

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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UNI Independent Distributors

Spain . 1,128 parts In-Stock

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1,128

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Perfect Parts

USA . 553 parts In-Stock

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553

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Technical Specifications

Receiver ICs SA605D/01,112 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

Additional Features:

IN-BUILT QUADRATURE DETECTOR

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (FM):

150 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Signal to Noise Ratio (FM):

73 dB

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SA605D/01,112 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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