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SA614AD,602

NXP Semiconductors

SA614AD,602 by NXP Semiconductors

SA614AD,602 by NXP Semiconductors is an audio demodulator IC with 16 terminals. Operating at temperatures from -40 to 85°C, it offers a signal-to-noise ratio of 68 dB for FM demodulation. With a small outline package style, it is ideal for industrial applications requiring FM demodulation capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,017 parts In-Stock

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Digiode

USA . 1,722 parts In-Stock

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Anansix

USA . 839 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Aztec Data Supply Inc.

USA . 1,421 parts In-Stock

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$0.580

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$0.580

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Corohmni

South Africa . 917 parts In-Stock

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$3.561

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One Stop Electronics

USA . 600 parts In-Stock

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$5.800

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$5.800

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Semicontronic

India . 126 parts In-Stock

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$15.800

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$15.405

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$15.326

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126

$15.800

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$15.326

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AZTECH Wire

Italy . 541 parts In-Stock

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$15.873

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$15.873

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Ampacity Inc.

Singapore . 1,595 parts In-Stock

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$18.800

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UNI Independent Distributors

Spain . 7,055 parts In-Stock

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Corphita

USA . 1,492 parts In-Stock

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Argo Parts USA

USA . 1,466 parts In-Stock

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Continental Prestige Electronics

USA . 1,210 parts In-Stock

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Bastille Electronics

Australia . 874 parts In-Stock

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Overview

Elevate your audio experience with the SA614AD,602 by NXP Semiconductors, a top-of-the-line receiver IC designed for optimal performance. Manufactured with quality and precision in mind, this small outline package offers a wide range of applications in industrial settings. With a nominal signal to noise ratio of 68 dB and a demodulation type of FM, this audio demodulator provides unparalleled clarity and reliability. Trust NXP Semiconductors to deliver innovative technology that exceeds expectations, making the SA614AD,602 the perfect choice for all your audio processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability makes installation and assembly easier, saving time and effort during production.

General IC Type: AUDIO DEMODULATOR

Specifically designed for audio demodulation, ensuring high-quality sound output in the application.

Power Supplies (V): 6

Operates at a moderate power supply voltage, making it suitable for a wide range of applications while maintaining efficiency.

Nominal Signal to Noise Ratio (FM): 68 dB

Provides a high signal to noise ratio for FM signals, delivering clear and crisp audio output.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with a wide operating temperature range, ensuring reliable performance in harsh conditions.

Technology: BIPOLAR

Utilizes bipolar technology, known for its reliability and stability in audio processing applications.

Technical Specifications

Receiver ICs SA614AD,602 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (FM):

530 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Signal to Noise Ratio (FM):

68 dB

Sub-Category:

Receiver ICs

Maximum Supply Current:

4 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

SA614AD,602 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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