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SA615D/01,118

NXP Semiconductors

SA615D/01,118 by NXP Semiconductors

SA615D/01,118 by NXP Semiconductors is an audio single chip receiver with 20 terminals in a small outline package. It operates b/w -40 to 85°C, demodulates FM signals with a signal-to-noise ratio of 68 dB. Ideal for industrial applications requiring compact and efficient audio reception.

Median Price

$4.240

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$4.240

1k+ parts

$3.790

10k+ parts

$3.570

10

-

$4.240

$3.790

$3.570

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.352

100+ parts

-

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10

$4.352

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Digiode

USA . 3,234 parts In-Stock

1+ parts

$4.484

100+ parts

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3,234

$4.484

-

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Vyrian

USA . 6,845 parts In-Stock

1+ parts

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6,845

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Flip Electronics

USA . 5,980 parts In-Stock

1+ parts

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5,980

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Anansix

USA . 2,618 parts In-Stock

1+ parts

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2,618

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Distributors (Availability)

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Ampacity Inc.

Singapore . 10 parts In-Stock

1+ parts

$4.010

100+ parts

-

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10

$4.010

-

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Corphita

USA . 4,076 parts In-Stock

1+ parts

$4.248

100+ parts

-

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4,076

$4.248

-

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$4.265

100+ parts

-

1k+ parts

$4.094

10k+ parts

-

1,000

$4.265

-

$4.094

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Argo Parts USA

USA . 4,439 parts In-Stock

1+ parts

$4.281

100+ parts

-

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4,439

$4.281

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Continental Prestige Electronics

USA . 1,994 parts In-Stock

1+ parts

$4.281

100+ parts

-

1k+ parts

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10k+ parts

$4.195

1,994

$4.281

-

-

$4.195

AZTECH Wire

Italy . 217 parts In-Stock

1+ parts

$16.031

100+ parts

-

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217

$16.031

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QUARKTWIN TECHNOLOGY LTD

USA . 13,501 parts In-Stock

1+ parts

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13,501

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UNI Independent Distributors

Spain . 7,311 parts In-Stock

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7,311

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

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1,500

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Perfect Parts

USA . 277 parts In-Stock

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277

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Overview

Discover the high-quality SA615D/01,118 Receiver IC by NXP Semiconductors, designed for exceptional audio performance. This versatile chip offers a wide range of applications and features a compact design for easy integration. With a focus on reliability and efficiency, NXP Semiconductors delivers a product that provides value and benefits to customers looking for top-notch receiver solutions. Experience the advantages of this innovative product and elevate your audio experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and mechanical protection for the IC.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

General IC Type: AUDIO SINGLE CHIP RECEIVER

Integration of multiple functions into a single chip reduces overall component count and simplifies circuit design.

No. of Terminals: 20

Provides sufficient connectivity options for various applications.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of operating conditions.

Minimum Operating Temperature: -40 °C

Can withstand harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance.

Nominal Signal to Noise Ratio (FM): 68 dB

Delivers high-quality audio signals with minimal interference.

Minimum Supply Voltage (Vsup): 4.5 V

Supports operation in low-power applications.

Peak Reflow Temperature °C: 260

Can withstand high-temperature assembly processes.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments.

Maximum Supply Current: 7.4 mA

Ensures efficient power consumption.

Nominal Output Voltage (FM): 530 mV

Provides a strong output signal for audio systems.

Terminal Pitch: 1.27 mm

Facilitates easy PCB layout and design.

Maximum Supply Voltage (Vsup): 8 V

Supports operation in voltage-sensitive applications.

Technical Specifications

Receiver ICs SA615D/01,118 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

Additional Features:

IN-BUILT QUADRATURE DETECTOR

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (FM):

530 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Signal to Noise Ratio (FM):

68 dB

Maximum Supply Current:

7.4 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SA615D/01,118 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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