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SA615DK/01

NXP Semiconductors

SA615DK/01 by NXP Semiconductors

SA615DK/01 by NXP Semiconductors is an audio single chip receiver with 20 terminals, operating temperature range of -40 to 85°C. It offers a signal-to-noise ratio of 68 dB for FM demodulation applications. This small outline IC has a low profile and shrink pitch package suitable for surface mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 4,763 parts In-Stock

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Anansix

USA . 2,886 parts In-Stock

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Vyrian

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Nova Conductors

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Ampacity Inc.

Singapore . 169 parts In-Stock

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$2.800

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One Stop Electronics

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AZTECH Wire

Italy . 359 parts In-Stock

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Lixinc

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Corphita

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Argo Parts USA

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Aranea Global

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Continental Prestige Electronics

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Overview

Discover the NXP Semiconductors SA615DK/01, a high-quality audio single chip receiver that offers exceptional performance and reliability. This versatile receiver IC is perfect for a wide range of applications, providing crystal-clear sound and seamless operation. With NXP Semiconductors' reputation for innovation and excellence in semiconductor manufacturing, you can trust that this product delivers unmatched value. Enhance your audio projects with the SA615DK/01 and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the IC, making it suitable for various environments.

Surface Mount: YES

Surface mount design allows for easy installation on circuit boards, saving space and simplifying assembly.

General IC Type: AUDIO SINGLE CHIP RECEIVER

Integration of audio receiver functions into a single chip reduces component count and simplifies circuit design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh operating conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the IC to function in both cold and hot environments.

Nominal Signal to Noise Ratio (FM): 68 dB

High signal to noise ratio ensures clear and interference-free audio reception.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage requirement allows for compatibility with various power sources.

Demodulation Type: FM

Frequency modulation demodulation capability enables the IC to receive FM audio signals.

Nominal Output Voltage (FM): 530 mV

Appropriate output voltage level for driving downstream audio components.

Technical Specifications

Receiver ICs SA615DK/01 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

Additional Features:

IN-BUILT QUADRATURE DETECTOR

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (FM):

530 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.5 mm

Nominal Signal to Noise Ratio (FM):

68 dB

Maximum Supply Current:

7.4 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

SA615DK/01 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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