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SA614AD

NXP Semiconductors

SA614AD by NXP Semiconductors

SA614AD by NXP Semiconductors is a small outline audio demodulator IC with 16 terminals. Operating b/w -40 to 85°C, it offers FM demodulation with a signal-to-noise ratio of 68 dB. Ideal for industrial applications, this IC requires a supply voltage of 4.5-8V and has a max supply current of 4 mA.

Median Price

$3.500

Lifecycle Status

EOL

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15

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1k+

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TEDSS.com

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Nova Conductors

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ECAB

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PC Components Company LLC

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Aztec Data Supply Inc.

USA . 3,201 parts In-Stock

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Corohmni

South Africa . 1,043 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

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AZTECH Wire

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Argo Parts USA

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Overview

Unlock the power of superior audio demodulation with the SA614AD by NXP Semiconductors. Crafted with precision and expertise, this receiver IC promises uncompromising quality and reliability. Ideal for a wide range of applications, this small outline package offers a seamless integration into your projects. Experience enhanced performance with a nominal signal-to-noise ratio of 68 dB and a nominal output voltage of 530 mV. Elevate your audio experience with the SA614AD and immerse yourself in unparalleled sound quality that only NXP Semiconductors can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during production.

General IC Type: AUDIO DEMODULATOR

Specifically designed for audio demodulation applications, ensuring optimal performance in audio systems.

Power Supplies (V): 6

Optimal power supply voltage for efficient operation without excess power consumption.

No. of Terminals: 16

Provides ample connectivity options for various components and peripherals in the circuit.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for use in a wide range of environments.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without overheating, ensuring reliability in harsh conditions.

Nominal Signal to Noise Ratio (FM): 68 dB

Delivers clear and high-quality audio signals with minimal interference or distortion.

Demodulation Type: FM

Specifically designed for Frequency Modulation (FM) demodulation applications, ensuring compatibility with FM audio systems.

Technology: BIPOLAR

Utilizes bipolar technology for fast and efficient signal processing, improving overall performance.

Technical Specifications

Receiver ICs SA614AD attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (FM):

530 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

6

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Signal to Noise Ratio (FM):

68 dB

Sub-Category:

Receiver ICs

Maximum Supply Current:

4 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

SA614AD General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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