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SA616DK/02,112

NXP Semiconductors

SA616DK/02,112 by NXP Semiconductors

SA616DK/02,112 by NXP Semiconductors is a Receiver IC with 20 terminals and 3V power supply. It operates in industrial temperature range (-40 to 85°C) and has a max supply current of 5mA. This small outline package is ideal for applications requiring high-performance receiver functionality.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,917 parts In-Stock

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Anansix

USA . 2,545 parts In-Stock

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Digiode

USA . 881 parts In-Stock

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881

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Ampacity Inc.

Singapore . 927 parts In-Stock

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$2.800

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927

$2.800

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AZTECH Wire

Italy . 382 parts In-Stock

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$8.031

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One Stop Electronics

USA . 337 parts In-Stock

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$8.800

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Argo Parts USA

USA . 4,028 parts In-Stock

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Corphita

USA . 3,311 parts In-Stock

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Continental Prestige Electronics

USA . 3,258 parts In-Stock

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UNI Independent Distributors

Spain . 1,874 parts In-Stock

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Aranea Global

USA . 100 parts In-Stock

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Overview

Enhance your electronic projects with the SA616DK/02,112 by NXP Semiconductors. As a leading manufacturer in the industry, NXP ensures top-quality receiver ICs that deliver exceptional performance and reliability. Ideal for a wide range of applications, this product offers outstanding value with its advanced features and benefits. From its durable package body material to its efficient power supplies, the SA616DK/02,112 is designed to meet your needs. Upgrade your projects today with this cutting-edge solution from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and ensures the IC is protected from external elements, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto a printed circuit board, saving space and simplifying the assembly process.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB, optimizing the layout and enhancing overall system performance.

Power Supplies (V): 3

Operates on a standard power supply voltage of 3V, making it compatible with a wide range of systems and applications.

No. of Terminals: 20

Having 20 terminals provides flexibility for various connections and functionalities, offering versatility in design and application.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline with shrink pitch design enables compact placement on the PCB, saving space and enhancing system efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in harsh environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in a wide range of temperatures, ensuring versatility and resilience in various conditions.

Terminal Position: DUAL

Dual terminal position offers redundancy and enhanced connectivity, promoting stable and reliable operation in complex systems.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification guarantees reliable performance in demanding environments, ideal for industrial and commercial applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure attachment to the PCB, reducing the risk of disconnection and improving overall system reliability.

Maximum Supply Current: 5 mA

Low maximum supply current consumption minimizes power usage, making it energy-efficient and cost-effective for long-term operation.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for precise connections and compact PCB design, ensuring accurate signal transmission and optimal system performance.

Technical Specifications

Receiver ICs SA616DK/02,112 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Receiver ICs

Maximum Supply Current:

5 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

SA616DK/02,112 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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