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SA616DK/02,118

NXP Semiconductors

SA616DK/02,118 by NXP Semiconductors

SA616DK/02,118 by NXP Semiconductors is a compact receiver IC designed for industrial applications. It operates within -40 °C to 85 °C, features a 20-terminal gull-wing design, and requires a 3V power supply with a max current of 5 mA. Ideal for surface mount technology in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,186 parts In-Stock

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Anansix

USA . 2,001 parts In-Stock

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2,001

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Digiode

USA . 848 parts In-Stock

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848

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Distributors (Availability)

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AZTECH Wire

Italy . 553 parts In-Stock

1+ parts

$15.440

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553

$15.440

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One Stop Electronics

USA . 1,555 parts In-Stock

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$16.800

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1,555

$16.800

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Component Stockers USA

USA . 331 parts In-Stock

1+ parts

$99.990

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331

$99.990

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UNI Independent Distributors

Spain . 4,037 parts In-Stock

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4,037

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Corphita

USA . 3,854 parts In-Stock

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3,854

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Overview

Unlock seamless connectivity with the SA616DK/02,118 from NXP Semiconductors, a trusted leader in high-performance solutions. This compact receiver IC excels in industrial applications, ensuring reliable communication even in extreme temperatures. With its innovative design and energy efficiency, it delivers exceptional value, helping you enhance productivity while minimizing costs. Elevate your project with NXP's commitment to quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resilience, making the receiver IC suitable for various environments.

Surface Mount: YES

Surface mount technology allows for compact designs, enabling integration into smaller circuit boards without compromising performance.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy placement and allows for efficient use of board space.

Power Supplies (V): 3

Operating at a low voltage of 3V improves energy efficiency and reduces power consumption, making it suitable for battery-operated devices.

No. of Terminals: 20

With 20 terminals, this IC provides sufficient connectivity options for various applications, enhancing its versatility.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline with a shrink pitch design allows for a higher density of components on the PCB, ideal for modern electronic devices.

Maximum Operating Temperature: 85 °C

Designed to operate at high temperatures, this IC can be used in industrial applications without risking performance reliability.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this receiver IC is suitable for harsh environments where extreme conditions are a concern.

Terminal Position: DUAL

The dual terminal position provides flexibility in PCB layout, accommodating various design requirements and improving assembly efficiency.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and stability over a wide temperature range, making it suitable for demanding applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide a strong mechanical connection, ensuring durability and long-lasting performance.

Maximum Supply Current: 5 mA

A maximum supply current of only 5 mA makes this IC power-efficient, ideal for low-power applications and extending the lifespan of battery-operated products.

Terminal Pitch: 0.635 mm

With a terminal pitch of 0.635 mm, this component allows for tighter packing of components on PCBs, making it a great choice for compact electronic designs.

Technical Specifications

Receiver ICs SA616DK/02,118 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Receiver ICs

Maximum Supply Current:

5 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

SA616DK/02,118 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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