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SA615DK/01,118

NXP Semiconductors

SA615DK/01,118 by NXP Semiconductors

SA615DK/01,118 by NXP Semiconductors is an audio single chip receiver with 20 terminals. It operates in industrial temperature range (-40 to 85 °C) and offers a signal to noise ratio of 68 dB for FM demodulation. This small outline IC is ideal for applications requiring high-quality audio reception in compact devices.

Median Price

$2.844

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$2.844

100+ parts

-

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15

$2.844

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Vyrian

USA . 8,518 parts In-Stock

1+ parts

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8,518

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Anansix

USA . 2,636 parts In-Stock

1+ parts

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2,636

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Digiode

USA . 2,043 parts In-Stock

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2,043

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Greenchips

USA . 60 parts In-Stock

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60

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,528 parts In-Stock

1+ parts

$2.844

100+ parts

-

1k+ parts

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10k+ parts

$2.787

5,528

$2.844

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-

$2.787

Argo Parts USA

USA . 2,926 parts In-Stock

1+ parts

$2.844

100+ parts

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2,926

$2.844

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Netroflash

USA . 100 parts In-Stock

1+ parts

$2.844

100+ parts

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100

$2.844

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Advanced Electronics

New Zealand . 33 parts In-Stock

1+ parts

$3.131

100+ parts

$2.849

1k+ parts

$2.567

10k+ parts

-

33

$3.131

$2.849

$2.567

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Ampacity Inc.

Singapore . 337 parts In-Stock

1+ parts

$6.800

100+ parts

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337

$6.800

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AZTECH Wire

Italy . 809 parts In-Stock

1+ parts

$8.230

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809

$8.230

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One Stop Electronics

USA . 1,180 parts In-Stock

1+ parts

$17.800

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1,180

$17.800

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 3,273 parts In-Stock

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3,273

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UNI Independent Distributors

Spain . 2,475 parts In-Stock

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2,475

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Perfect Parts

USA . 325 parts In-Stock

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325

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Overview

Experience crystal-clear sound quality with the SA615DK/01,118 from NXP Semiconductors. As a leading manufacturer of Receiver ICs, NXP guarantees top-notch performance and reliability. This audio single chip receiver is compact, easy to install, and ideal for a wide range of applications. With a superior signal-to-noise ratio and low operating temperature, this product offers exceptional value and benefits to customers looking for high-quality audio solutions. Upgrade your audio experience today with the SA615DK/01,118 by NXP Semiconductors.

Feature Benefit Bullets

Package Body Material PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the IC, making it suitable for various applications.

Surface Mount YES

Being surface mountable makes the IC easy to integrate into circuit boards, saving space and simplifying assembly.

Package Shape RECTANGULAR

The rectangular shape allows for efficient placement and compact design within electronic devices.

General IC Type AUDIO SINGLE CHIP RECEIVER

The single chip receiver design simplifies circuitry and reduces component count, leading to cost savings and improved reliability.

No. of Terminals 20

Having 20 terminals allows for versatile connectivity options and functionality in various audio applications.

Package Style (Meter) SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline and low profile design with shrink pitch enables compact and space-saving board layout, ideal for portable devices.

Maximum Operating Temperature 85 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature -40 °C

With a low minimum operating temperature, the IC can withstand cold environments without compromising functionality.

Terminal Finish NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position DUAL

Having dual terminal positions allows for versatile mounting options and ease of soldering during PCB assembly.

Maximum Seated Height 1.5 mm

The low maximum seated height enables slim and compact designs for electronic devices.

Nominal Signal to Noise Ratio (FM) 68 dB

The high signal to noise ratio ensures clear and high-quality audio reception for an optimal user experience.

Width 4.4 mm

The narrow width makes the IC suitable for space-constrained applications while maintaining functionality.

Minimum Supply Voltage (Vsup) 4.5 V

The low minimum supply voltage allows for efficient power consumption and compatibility with various power sources.

Peak Reflow Temperature °C 260

The high peak reflow temperature facilitates reliable soldering during assembly processes.

Length 6.5 mm

The compact length contributes to a space-saving design, suitable for compact electronic devices.

Demodulation Type FM

The FM demodulation type ensures compatibility with FM audio transmission systems, providing reliable reception.

Temperature Grade INDUSTRIAL

The industrial temperature grade makes the IC suitable for a wide range of industrial applications with varying environmental conditions.

Terminal Form GULL WING

The gull wing terminal form facilitates easy soldering and reliable connections during PCB assembly.

Maximum Supply Current 7.4 mA

The low maximum supply current ensures energy efficiency and minimal power consumption during operation.

Nominal Output Voltage (FM) 530 mV

The nominal output voltage of 530 mV provides a stable and consistent signal output for audio applications.

Terminal Pitch 0.65 mm

The small terminal pitch allows for high-density mounting on PCBs, saving space and enabling compact designs.

Maximum Supply Voltage (Vsup) 8 V

The high maximum supply voltage offers flexibility in power input options while ensuring reliable performance within the specified range.

Technical Specifications

Receiver ICs SA615DK/01,118 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

Additional Features:

IN-BUILT QUADRATURE DETECTOR

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (FM):

530 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Nominal Signal to Noise Ratio (FM):

68 dB

Maximum Supply Current:

7.4 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

SA615DK/01,118 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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