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TEA5712T-T

NXP Semiconductors

TEA5712T-T by NXP Semiconductors

TEA5712T-T by NXP Semiconductors is a compact audio single-chip receiver with a max supply voltage of 12V and operates b/w -15 °C to 60 °C. It features low harmonic distortion at 0.8% and supports AM/FM demodulation. Ideal for various audio applications, it comes in a small outline package with 32 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,495 parts In-Stock

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3,495

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Anansix

USA . 1,622 parts In-Stock

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1,622

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Digiode

USA . 1,437 parts In-Stock

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1,437

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,160 parts In-Stock

1+ parts

$4.800

100+ parts

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1,160

$4.800

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UNI Independent Distributors

Spain . 7,726 parts In-Stock

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7,726

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Corphita

USA . 1,837 parts In-Stock

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1,837

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Overview

Unlock unparalleled audio quality with the TEA5712T-T from NXP Semiconductors, a leader in innovative solutions. This advanced receiver IC enhances your audio applications, delivering crystal-clear sound with minimal distortion. Ideal for consumer electronics and automotive systems, its compact design ensures seamless integration, while its reliability across various environments puts you ahead in performance and efficiency. Elevate your projects with a trusted partner in technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the IC suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easier and more compact integration onto PCBs, optimizing space in electronic designs.

Package Shape: RECTANGULAR

The rectangular shape offers a space-efficient design that can be easily accommodated in various PCB layouts.

General IC Type: AUDIO SINGLE CHIP RECEIVER

This type of receiver is designed specifically for audio applications, ensuring high fidelity sound processing.

Harmonic Distortion: 0.8%

A low harmonic distortion ensures that the audio output remains clean and free from unwanted noise or artifacts, delivering superior sound quality.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options, facilitating customization and integration into complex circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-restricted applications, enhancing the versatility of the design.

Maximum Operating Temperature: 60 °C

With a maximum operating temperature of 60 °C, the IC is reliable for use in a variety of thermal environments.

Minimum Operating Temperature: -15 °C

The capability to operate down to -15 °C expands its usability in cooler climates and environments.

Terminal Position: DUAL

Dual terminal positioning enhances the device's flexibility in circuit board layouts and assists in better mounting.

Maximum Seated Height: 2.65 mm

A low seated height minimizes the profile of the device, which is beneficial for compact designs.

Width: 7.5 mm

A narrow width aids in fitting the IC into tighter spaces, offering more design/layout options.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage allows for energy-efficient designs, accommodating battery-operated devices.

Length: 20.5 mm

The length of 20.5 mm strikes a balance between functionality and space requirements in design.

Nominal Output Voltage (AM): 45 mV

With a nominal output voltage of 45 mV for AM signals, the chip is optimized for clear audio transmission.

Demodulation Type: AM/FM

The ability to demodulate both AM and FM signals makes this receiver versatile for a range of audio reception needs.

Temperature Grade: COMMERCIAL

Being commercially graded enhances reliability in standard industrial applications without exceeding extreme environmental conditions.

Technology: BIMOS

BIMOS technology combines the benefits of both bipolar and CMOS technologies, offering better performance and lower power consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and mounting, ensuring reliable connections in assembly.

Nominal Output Voltage (FM): 61 mV

A nominal output voltage of 61 mV for FM improves signal clarity and enhances overall audio quality.

Terminal Pitch: 1.27 mm

The standard terminal pitch of 1.27 mm allows for matching with numerous PCB designs, simplifying the manufacturing process.

Maximum Supply Voltage (Vsup): 12 V

A higher maximum supply voltage of 12 V enables the IC to cater to various voltage levels in modern audio systems.

Technical Specifications

Receiver ICs TEA5712T-T attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

.8 %

JESD-30 Code:

R-PDSO-G32

Length:

20.5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-15 Cel

Nominal Output Voltage (AM):

45 mV

Nominal Output Voltage (FM):

61 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Technology:

BIMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TEA5712T-T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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