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LA75520VA

Onsemi

LA75520VA by Onsemi

LA75520VA by Onsemi is a 24-terminal audio/video demodulator IC in a small outline package. It features AM/FM demodulation, gull wing terminals with 0.65mm pitch, and a low profile design at 1.5mm seated height. Ideal for applications requiring precise signal processing in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,917 parts In-Stock

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Digiode

USA . 1,584 parts In-Stock

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1,584

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Distributors (Availability)

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TANS Electronics

Latvia . 7,944 parts In-Stock

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7,944

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Kulean Microsystems

USA . 2,303 parts In-Stock

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2,303

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Problanco Electronics

Mexico . 1,002 parts In-Stock

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1,002

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SupplyDigital Components

Austria . 657 parts In-Stock

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657

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Corphita

USA . 172 parts In-Stock

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172

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Corohmni

South Africa . 84 parts In-Stock

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84

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UHIMA Technologies

Türkiye . 16 parts In-Stock

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Overview

Experience the unparalleled quality and innovation of Onsemi with the LA75520VA receiver IC. This cutting-edge product offers exceptional audio/video demodulation capabilities, making it ideal for a wide range of applications. With its sleek design and compact size, this small outline, low profile IC is perfect for space-constrained projects. Trust in Onsemi's reputation for excellence and discover the value and benefits this product brings to your next project. Elevate your designs with the LA75520VA and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, ensuring a long lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost.

Package Shape: RECTANGULAR

Rectangular package shape is versatile and compact, making it suitable for various electronic designs.

General IC Type: AUDIO/VIDEO DEMODULATOR

Audio/video demodulator functionality enables the IC to process and decode audio and video signals effectively.

No. of Terminals: 24

24 terminals provide ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Small outline, low profile, and shrink pitch package style saves space on the PCB while offering a modern design.

Terminal Position: DUAL

Dual terminal position improves signal transmission efficiency and facilitates easier PCB layout.

Maximum Seated Height: 1.5 mm

Low maximum seated height enables the IC to be used in compact electronic devices without compromising space constraints.

Width: 5.6 mm

Narrow width allows for dense PCB layout and integration of multiple components within limited space.

Length: 7.8 mm

Short length contributes to the overall compactness of the IC and helps in fitting it into small electronic products.

Demodulation Type: AM/FM

AM/FM demodulation capability enables the IC to decode both amplitude and frequency modulated signals, expanding its application range.

Terminal Form: GULL WING

Gull wing terminal form offers reliable solder connections and ease of assembly during PCB manufacturing.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density PCB layout, making the IC suitable for compact electronic devices with limited space.

Technical Specifications

Receiver ICs LA75520VA attributes and parameters. Explore more Receiver ICs devices from Onsemi

Specs

General IC Type:

Demodulation Type:

AM/FM

JESD-30 Code:

R-PDSO-G24

Length:

7.8 mm

No. of Functions:

1

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.5 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.6 mm

Trade Compliance

LA75520VA General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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