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TDA8213

STMicroelectronics

TDA8213 by STMicroelectronics

TDA8213 by STMicroelectronics is an audio/video demodulator IC with 20 terminals. It operates on power supplies ranging from 8V to 12.8V, drawing a max current of 28mA. This receiver IC is commonly used in applications requiring audio and video signal processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,964 parts In-Stock

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Vyrian

USA . 2,957 parts In-Stock

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Anansix

USA . 2,218 parts In-Stock

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2,218

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Sogenti Electronics

Canada . 1,375 parts In-Stock

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ECAB

Sweden . 931 parts In-Stock

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931

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ACDS - Activité Composants Distribution Service

France . 119 parts In-Stock

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ComSIT Distribution GmbH

Germany . 60 parts In-Stock

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Huijzer Components

Netherlands . 13 parts In-Stock

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LittleDiode

UK . 7 parts In-Stock

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GES GmbH

Germany . 2 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,862 parts In-Stock

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$1.341

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$1.207

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$1.341

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$1.207

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MKK Technologies

India . 1,622 parts In-Stock

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$2.522

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DigiPath Technology Company

USA . 1,622 parts In-Stock

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$2.522

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Corphita

USA . 4,574 parts In-Stock

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Parana Technologies

USA . 2,258 parts In-Stock

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$1.604

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Kepictronics

USA . 1,975 parts In-Stock

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Assy Fe

Spain . 1,046 parts In-Stock

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Perfect Parts

USA . 759 parts In-Stock

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759

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GreenTree Electronics

Israel . 440 parts In-Stock

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440

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Cyclops Electronics Ltd (Excess)

UK . 119 parts In-Stock

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Overview

Elevate your audio and video experience with the TDA8213 Receiver IC by STMicroelectronics. With a reputation for quality and innovation, STMicroelectronics delivers cutting-edge technology in a compact, durable package. Ideal for a wide range of applications, this audio/video demodulator offers exceptional performance and reliability. Enhance your projects with the TDA8213's superior value, benefits, and advantages, providing customers with an unparalleled audio/video solution that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable and long-lasting electronic devices.

Package Shape: RECTANGULAR

The rectangular shape allows for compact and efficient integration into circuit boards, saving space and allowing for more components to be included in a design.

General IC Type: AUDIO/VIDEO DEMODULATOR

The audio/video demodulator type ensures high-quality signal demodulation for accurate and clear audio and video output.

Power Supplies (V): 9

Operating at a power supply of 9V provides a stable and reliable voltage for optimal performance of the receiver ICs.

No. of Terminals: 20

Having 20 terminals allows for a variety of connections and functionality, making the IC versatile and suitable for different applications.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to connect the IC in a linear fashion, simplifying the circuit layout and design process.

Terminal Finish: TIN LEAD

The tin lead terminal finish ensures good conductivity and reliability in electrical connections, reducing the risk of signal loss or interference.

Terminal Position: DUAL

The dual terminal position allows for increased flexibility in circuit design and layout, accommodating different connection configurations.

Minimum Supply Voltage (Vsup): 8 V

Operating at a minimum supply voltage of 8V ensures that the IC can function properly even under varying voltage conditions, enhancing its reliability.

Technology: BIPOLAR

The bipolar technology offers high-speed performance and low noise operation, contributing to the overall quality and efficiency of the receiver IC.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure and durable connections to the circuit board, minimizing the risk of disconnection or damage during operation.

Maximum Supply Current: 28 mA

The maximum supply current of 28mA ensures that the IC operates within safe limits, preventing overheating and potential damage to the device.

Terminal Pitch: 2.54 mm

The terminal pitch of 2.54mm allows for easy and precise soldering of connections, facilitating efficient assembly and maintenance of the IC.

Maximum Supply Voltage (Vsup): 12.8 V

The maximum supply voltage of 12.8V provides a safe operating range for the IC, protecting it from potential voltage spikes or fluctuations.

Technical Specifications

Receiver ICs TDA8213 attributes and parameters. Explore more Receiver ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

28 mA

Maximum Supply Voltage (Vsup):

12.8 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TDA8213 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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