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TEA5711TD

NXP Semiconductors

TEA5711TD by NXP Semiconductors

TEA5711TD by NXP Semiconductors is a compact audio single-chip receiver designed for AM/FM applications. It features a low harmonic distortion of 0.8%, operates b/w -15 °C to 60 °C, and supports supply voltages from 1.8V to 12V. Ideal for consumer electronics, it ensures high-quality audio performance in a small footprint.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 3,659 parts In-Stock

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3,659

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Vyrian

USA . 444 parts In-Stock

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444

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Anansix

USA . 277 parts In-Stock

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277

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One Stop Electronics

USA . 784 parts In-Stock

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$9.800

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784

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Corphita

USA . 2,764 parts In-Stock

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UNI Independent Distributors

Spain . 1,678 parts In-Stock

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Overview

Elevate your audio applications with the TEA5711TD from NXP Semiconductors, a leader in cutting-edge technology. This versatile receiver IC delivers exceptional sound quality while ensuring robust performance across various environments, from automotive to consumer electronics. With its compact design and reliable operation, it allows for seamless integration and enhanced listening experiences, making it the perfect choice for innovators seeking superior audio solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body offers durability and protection against environmental factors, ensuring a reliable performance.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs, making it suitable for modern, space-constrained applications.

Package Shape: RECTANGULAR

Rectangular packaging optimizes space utilization on PCBs, facilitating efficient layout design.

General IC Type: AUDIO SINGLE CHIP RECEIVER

As a single-chip audio receiver, it simplifies circuit design by reducing the number of components required.

Harmonic Distortion: 0.8 %

Low harmonic distortion ensures high-quality audio output, making this IC ideal for audio applications.

No. of Terminals: 32

With 32 terminals, this IC provides ample connectivity options for various configurations and designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style aids in maintaining a compact footprint while optimizing layout efficiency.

Maximum Operating Temperature: 60 °C

A maximum operating temperature of 60 °C ensures reliable operation in most environments, catering to a wide range of applications.

Minimum Operating Temperature: -15 °C

The ability to operate at -15 °C enhances the IC's suitability for outdoor or harsh environments.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options, simplifying integration into various board layouts.

Maximum Seated Height: 2.65 mm

A low maximum seated height contributes to a compact design, facilitating ease of placement in space-constrained environments.

Width: 7.5 mm

A width of 7.5 mm helps in compact designs and allows for easier routing on PCBs.

Minimum Supply Voltage (Vsup): 1.8 V

The low minimum supply voltage requirement enhances power efficiency, making it suitable for battery-operated devices.

Maximum Time At Peak Reflow Temperature: 40 s

A maximum of 40 seconds at peak reflow temperature prevents damage during manufacturing, ensuring reliability in production.

Peak Reflow Temperature: 245 °C

A peak reflow temperature of 245 °C is compatible with modern soldering practices, facilitating assembly.

Length: 20.5 mm

A length of 20.5 mm strikes a balance between compactness and ease of installation on a PCB.

Nominal Output Voltage (AM): 45 mV

A nominal output voltage of 45 mV for AM signals ensures compatibility with standard audio processing components.

Demodulation Type: AM/FM

Support for both AM and FM demodulation widens its application range in audio receivers.

Temperature Grade: COMMERCIAL

The commercial temperature grade makes it suitable for general consumer electronics applications.

Technology: BIMOS

BIMOS technology combines the benefits of both bipolar and MOSFET transistors, enhancing performance and efficiency.

Terminal Form: GULL WING

Gull wing terminals allow for easy soldering and improve the mechanical stability of the component once mounted.

Maximum Supply Current: 20 mA

A maximum supply current of 20 mA enables power efficiency, making it suitable for low-power portable devices.

Nominal Output Voltage (FM): 61 mV

A nominal output voltage of 61 mV for FM signals ensures compatibility with a wide range of audio processing systems.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for flexible PCB design while ensuring reliable connections.

Maximum Supply Voltage (Vsup): 12 V

The capability to operate at a maximum supply voltage of 12 V makes it versatile for various power supply configurations.

Technical Specifications

Receiver ICs TEA5711TD attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

.8 %

JESD-30 Code:

R-PDSO-G32

Length:

20.5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-15 Cel

Nominal Output Voltage (AM):

45 mV

Nominal Output Voltage (FM):

61 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

BIMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

TEA5711TD General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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