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STV8203

STMicroelectronics

STV8203 by STMicroelectronics

STV8203 by STMicroelectronics is an audio demodulator IC with 0.2% harmonic distortion, operating at 5-8V. It features a rectangular package style with 42 terminals and demodulates FM signals. Ideal for commercial applications requiring precise audio signal processing in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,723 parts In-Stock

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2,723

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Anansix

USA . 914 parts In-Stock

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914

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Digiode

USA . 628 parts In-Stock

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628

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,444 parts In-Stock

1+ parts

$0.983

100+ parts

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$0.885

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1,444

$0.983

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$0.885

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MKK Technologies

India . 1,456 parts In-Stock

1+ parts

$1.849

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1,456

$1.849

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DigiPath Technology Company

USA . 1,456 parts In-Stock

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$1.849

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1,456

$1.849

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Corphita

USA . 4,303 parts In-Stock

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4,303

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Parana Technologies

USA . 2,369 parts In-Stock

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$1.176

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2,369

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$1.176

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Assy Fe

Spain . 169 parts In-Stock

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169

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Overview

Experience crystal clear audio like never before with the STV8203 from STMicroelectronics. Known for their top-notch quality and reliability, STMicroelectronics delivers another exceptional product in the Receiver ICs category. This audio demodulator offers unmatched performance with a low harmonic distortion of just 0.2%. Perfect for a wide range of applications, this IC is a game-changer for audio enthusiasts and professionals alike. Upgrade your audio experience today with the STV8203 and enjoy the benefits of superior sound quality and precision engineering.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability of the package, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into different electronic systems and PCB designs.

General IC Type: AUDIO DEMODULATOR

The audio demodulator type ensures efficient and accurate demodulation of audio signals, resulting in high-quality sound output.

Harmonic Distortion: 0.2%

Low harmonic distortion of 0.2% ensures clear and distortion-free audio output, making it ideal for audio applications.

Power Supplies (V): 5, 8

Support for power supplies of 5V and 8V offers flexibility in power requirements, making it compatible with a wide range of systems.

No. of Terminals: 42

With 42 terminals, this IC provides ample connection options for various input and output signals, enhancing its versatility.

Maximum Operating Temperature: 70 °C

High maximum operating temperature of 70 °C ensures reliable performance even in challenging environments.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0 °C means this IC can function effectively in a wide range of temperature conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good conductivity and solderability, ensuring secure and stable connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in installation and wiring, allowing for easier integration into various systems.

Width: 15.24 mm

Compact width of 15.24mm makes this IC suitable for space-constrained applications and PCB layouts.

Length: 38.1 mm

With a length of 38.1mm, this IC provides a balanced form factor for efficient placement and installation.

Demodulation Type: FM

FM demodulation type ensures accurate and noise-free demodulation of frequency modulated signals, making it ideal for audio applications.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation in standard operating conditions, suitable for commercial electronic devices.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the IC.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure and stable connections, suitable for rugged applications and environments.

Nominal Output Voltage (FM): 2000 mV

High nominal output voltage of 2000mV ensures sufficient signal strength for audio output, delivering clear and loud sound.

Terminal Pitch: 1.778 mm

With a terminal pitch of 1.778mm, this IC allows for precise and compact PCB design, optimizing space and layout efficiency.

Maximum Supply Voltage (Vsup): 5.25 V

Support for a maximum supply voltage of 5.25V offers a safety margin and protection against voltage spikes, ensuring the longevity of the IC.

Technical Specifications

Receiver ICs STV8203 attributes and parameters. Explore more Receiver ICs devices from STMicroelectronics

Specs

General IC Type:

Demodulation Type:

FM

Harmonic Distortion:

.2 %

JESD-30 Code:

R-PDIP-T42

JESD-609 Code:

e0

Length:

38.1 mm

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Voltage (FM):

2000 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP42,.6

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5,8

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

STV8203 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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