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E-TDA7421N

STMicroelectronics

E-TDA7421N by STMicroelectronics

E-TDA7421N by STMicroelectronics is a low-profile audio single-chip receiver with a harmonic distortion of just 1%. It operates b/w -40 °C to 85°C and supports AM/FM demodulation with nominal output voltages of 107 mV (AM) and 400 mV (FM). Ideal for industrial applications, it features a compact square package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 7,680 parts In-Stock

1+ parts

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7,680

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Digiode

USA . 3,169 parts In-Stock

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3,169

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Anansix

USA . 2,459 parts In-Stock

1+ parts

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2,459

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Vyrian

USA . 2,367 parts In-Stock

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2,367

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 818 parts In-Stock

1+ parts

$3.468

100+ parts

-

1k+ parts

$3.122

10k+ parts

-

818

$3.468

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$3.122

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MKK Technologies

India . 1,223 parts In-Stock

1+ parts

$6.522

100+ parts

-

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1,223

$6.522

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DigiPath Technology Company

USA . 1,223 parts In-Stock

1+ parts

$6.522

100+ parts

-

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1,223

$6.522

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Native Components

USA . 434 parts In-Stock

1+ parts

$9.750

100+ parts

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434

$9.750

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Northwest PG Solutions

USA . 1,615 parts In-Stock

1+ parts

$10.725

100+ parts

$9.652

1k+ parts

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1,615

$10.725

$9.652

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Corphita

USA . 2,335 parts In-Stock

1+ parts

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2,335

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Parana Technologies

USA . 775 parts In-Stock

1+ parts

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100+ parts

$4.147

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775

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$4.147

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Overview

Elevate your audio applications with the E-TDA7421N from STMicroelectronics, a leading name in semiconductor innovation. This high-quality single-chip receiver combines exceptional performance with reliability, ensuring crystal-clear sound and minimal distortion for your devices. With its robust design, it thrives in industrial environments, making it ideal for diverse projects—from automotive systems to consumer electronics. Unlock superior audio experiences and maximize your design potential with this cutting-edge solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, ensuring long-term performance.

Surface Mount: YES

Surface mount technology allows for compact designs and is ideal for modern electronic assembly processes.

Package Shape: SQUARE

Square package shape optimizes space on printed circuit boards, making it versatile for various applications.

General IC Type: AUDIO SINGLE CHIP RECEIVER

Designed specifically for audio applications, this IC ensures superior sound quality and reliable performance.

Harmonic Distortion: 1 %

Low harmonic distortion ensures high fidelity audio output, enhancing the overall listening experience.

No. of Terminals: 64

A higher number of terminals allows for more complex functionalities and connections, making the IC suitable for advanced applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style is ideal for space-constrained designs and provides excellent thermal and electrical performance.

Maximum Operating Temperature: 85 °C

The ability to operate at higher temperatures enhances reliability in various environments, including industrial settings.

Minimum Operating Temperature: -40 °C

Wide operating temperature range makes this IC suitable for harsh conditions, ensuring functionality in extreme environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish ensures excellent conductivity and corrosion resistance, enhancing the longevity of connections.

Terminal Position: QUAD

Quad terminal positioning enables efficient routing on the circuit board, making it easier for design engineers.

Maximum Seated Height: 1.6 mm

Low profile design helps in maintaining a sleek overall product design, minimizing space requirements.

Width: 10 mm

Compact width makes it suitable for tight layouts and enables easier integration into various devices.

Minimum Supply Voltage (Vsup): 7.5 V

Minimum voltage requirement allows for compatibility with a variety of power supply options, increasing design flexibility.

Maximum Time At Peak Reflow Temperature: 30 s

Convenient reflow profile reduces the risks of damage during assembly, ensuring robust manufacturing processes.

Peak Reflow Temperature: 260 °C

High peak temperature tolerance allows the IC to withstand modern soldering processes without compromising integrity.

Length: 10 mm

Short length contributes to a compact footprint, making it a versatile part for various applications.

Nominal Output Voltage (AM): 107 mV

This output level ensures compatibility with common audio systems, enhancing integration capabilities.

Demodulation Type: AM/FM

Supports both AM and FM signals, providing versatility for different types of communication applications.

Temperature Grade: INDUSTRIAL

Industrial grade components are built for durability and reliability, making them suitable for demanding applications.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS, enabling high speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide excellent mechanical stability on PCBs.

Nominal Output Voltage (FM): 400 mV

Higher output voltage for FM signals ensures strong signal integrity over longer distances.

Terminal Pitch: 0.5 mm

Fine pitch allows for high-density designs, crucial for modern compact electronic assemblies.

Moisture Sensitivity Level (MSL): 3

MSL 3 classification indicates moderate sensitivity to moisture, allowing for standard handling and storage practices.

Maximum Supply Voltage (Vsup): 10 V

A higher maximum supply voltage provides flexibility in powering the IC with various sources, accommodating diverse applications.

Technical Specifications

Receiver ICs E-TDA7421N attributes and parameters. Explore more Receiver ICs devices from STMicroelectronics

Specs

Additional Features:

IT ALSO REQUIRES 4.75V TO 5.25V SUPPLY

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

1 %

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (AM):

107 mV

Nominal Output Voltage (FM):

400 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

E-TDA7421N General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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