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TEA5711T-T

NXP Semiconductors

TEA5711T-T by NXP Semiconductors

TEA5711T-T by NXP Semiconductors is a compact audio single-chip receiver with a max supply voltage of 12V and operates b/w -15 °C to 60 °C. It features low harmonic distortion at 0.8% and a signal-to-noise ratio of 26dB, ideal for AM/FM applications. Its small outline package ensures efficient surface mounting in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,483 parts In-Stock

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4,483

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Vyrian

USA . 3,345 parts In-Stock

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3,345

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Anansix

USA . 2,190 parts In-Stock

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2,190

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 524 parts In-Stock

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$12.800

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524

$12.800

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Corphita

USA . 4,055 parts In-Stock

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4,055

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UNI Independent Distributors

Spain . 1,077 parts In-Stock

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Overview

Experience unparalleled audio clarity with the TEA5711T-T from NXP Semiconductors, a leader in innovative technology. This versatile single-chip receiver delivers exceptional performance in various applications, ensuring your devices achieve high-quality sound. With its robust design and advanced demodulation capabilities, you can enjoy reliability, reduced distortion, and optimal efficiency. Elevate your audio projects with a product backed by NXP's commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, making the IC suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on the PCB, enabling miniaturization of devices.

Package Shape: RECTANGULAR

The rectangular shape ensures efficient layout on PCBs, facilitating better circuitry design.

General IC Type: AUDIO SINGLE CHIP RECEIVER

As an audio single chip receiver, it simplifies circuit design by integrating multiple functions into one component.

Harmonic Distortion: 0.8%

Low harmonic distortion ensures high audio fidelity, making it ideal for high-quality audio applications.

No. of Terminals: 32

Having 32 terminals allows for versatile connectivity options, supporting a range of application needs.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to space-saving designs and enhanced performance in compact circuitry.

Maximum Operating Temperature: 60 °C

With a maximum operating temperature of 60 °C, it can operate efficiently in moderate thermal conditions.

Minimum Operating Temperature: -15 °C

A minimum operating temperature of -15 °C enables reliable performance in cooler environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent corrosion resistance, ensuring durability and reliability.

Terminal Position: DUAL

Dual terminal positions facilitate easy integration into various PCB layouts, enhancing design flexibility.

Maximum Seated Height: 2.65 mm

A low seated height offers compatibility with compact design requirements in modern electronics.

Nominal Signal to Noise Ratio (FM): 26 dB

A signal-to-noise ratio of 26 dB ensures clear audio reception with minimal background noise.

Width: 7.5 mm

Compact width makes it suitable for space-constrained applications, enhancing design versatility.

Minimum Supply Voltage (Vsup): 1.8 V

A low minimum supply voltage allows compatibility with battery-operated devices, extending device use.

Length: 20.5 mm

The length is optimized for integration into standard circuit layouts while maintaining performance.

Nominal Output Voltage (AM): 45 mV

The nominal output voltage for AM operations ensures effective signal transmission without distortion.

Demodulation Type: AM/FM

Support for both AM and FM demodulation increases versatility, allowing use in diverse audio applications.

Temperature Grade: COMMERCIAL

Being commercially graded means it meets standard operating conditions for a wide range of applications.

Technology: BIMOS

BIMOS technology combines benefits of both bipolar and MOS transistors, enhancing circuit efficiency.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and assembly on PCBs, improving manufacturing efficiency.

Maximum Supply Current: 20.2 mA

A relatively low maximum supply current aids in power efficiency, making it ideal for low-power applications.

Nominal Output Voltage (FM): 61 mV

The nominal output voltage for FM operations ensures strong signal delivery, optimizing audio performance.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm accommodates a wide range of PCB layouts and underscores design flexibility.

Maximum Supply Voltage (Vsup): 12 V

The maximum supply voltage of 12 V allows for greater adaptability in power supply configurations.

Technical Specifications

Receiver ICs TEA5711T-T attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

.8 %

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e4

Length:

20.5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-15 Cel

Nominal Output Voltage (AM):

45 mV

Nominal Output Voltage (FM):

61 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Signal to Noise Ratio (FM):

26 dB

Maximum Supply Current:

20.2 mA

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Technology:

BIMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TEA5711T-T General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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