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E-TDA7514TR

STMicroelectronics

E-TDA7514TR by STMicroelectronics

E-TDA7514TR by STMicroelectronics is a low-profile audio single-chip receiver with a harmonic distortion of just 0.02% and an FM SNR of 65 dB. It features a compact square package (14mm x 14mm) suitable for surface mount applications. Ideal for AM/FM demodulation in consumer electronics, it ensures high-quality audio performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,664 parts In-Stock

1+ parts

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4,664

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Digiode

USA . 2,697 parts In-Stock

1+ parts

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2,697

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Anansix

USA . 498 parts In-Stock

1+ parts

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498

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,390 parts In-Stock

1+ parts

$2.658

100+ parts

-

1k+ parts

$2.392

10k+ parts

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1,390

$2.658

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$2.392

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MKK Technologies

India . 1,497 parts In-Stock

1+ parts

$4.998

100+ parts

-

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1,497

$4.998

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DigiPath Technology Company

USA . 1,497 parts In-Stock

1+ parts

$4.998

100+ parts

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1,497

$4.998

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Component Stockers USA

USA . 787 parts In-Stock

1+ parts

$99.990

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787

$99.990

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Parana Technologies

USA . 2,005 parts In-Stock

1+ parts

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100+ parts

$3.178

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2,005

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$3.178

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Corphita

USA . 851 parts In-Stock

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851

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Northwest PG Solutions

USA . 259 parts In-Stock

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259

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Native Components

USA . 235 parts In-Stock

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235

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Overview

Elevate your audio applications with the E-TDA7514TR from STMicroelectronics, a trusted leader in innovative technology. This high-performance audio receiver IC delivers crystal-clear sound, boasting minimal distortion and impressive signal-to-noise ratios. Its compact, low-profile design ensures seamless integration into your projects. Experience unparalleled quality and reliability, making it the perfect choice for automotive, consumer electronics, and communication systems. Unlock superior audio experiences today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material offers durability and protection against environmental factors, making the IC reliable in various applications.

Surface Mount: YES

Surface mount technology enables efficient use of PCB space and allows for automated assembly processes, enhancing overall manufacturing efficiency.

Package Shape: SQUARE

The square package shape provides uniformity in layout, promoting better thermal performance and easier integration into compact designs.

General IC Type: AUDIO SINGLE CHIP RECEIVER

Being an audio single chip receiver, this product excels in audio applications, simplifying design requirements while maintaining high performance.

Harmonic Distortion: 0.02%

A low harmonic distortion ensures high audio fidelity, making this IC suitable for high-quality audio transmission.

No. of Terminals: 80

The high number of terminals allows for multiple functions and connections, enhancing flexibility in system design.

Package Style (Meter): FLATPACK, LOW PROFILE

A low profile flatpack design is ideal for space-constrained applications, making it easy to integrate into portable devices.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and protects against corrosion, ensuring reliable electrical connections.

Terminal Position: QUAD

The quad terminal positioning facilitates easy routing on the PCB, optimizing layout and reducing signal interference.

Maximum Seated Height: 1.6 mm

A low seated height supports designs requiring minimal height profiles, particularly useful in handheld devices.

Nominal Signal to Noise Ratio (FM): 65 dB

A high signal-to-noise ratio improves audio clarity in FM applications, making it suitable for premium audio systems.

Width: 14 mm

A compact width allows for easier embedding within various audio devices without sacrificing performance.

Maximum Time At Peak Reflow Temperature: 30 s

This specification ensures that the manufacturing process can effectively solder the IC without damaging it.

Peak Reflow Temperature: 250 °C

A high peak reflow temperature indicates compatibility with modern manufacturing processes and materials.

Length: 14 mm

Its uniform dimensions facilitate consistent spacing in PCB layouts, enhancing manufacturability.

Nominal Output Voltage (AM): 370 mV

A nominal output voltage of 370 mV for AM ensures effective signal transmission in amplitude modulation applications.

Demodulation Type: AM/FM

Supporting both AM and FM demodulation makes this receiver versatile for diverse audio applications.

Nominal Output Voltage (FM): 243 mV

A 243 mV output voltage in FM operations ensures strong signal strength, vital for clear audio playback.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is suitable for high-density interconnections, enhancing compact PCB designs.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates reasonable handling precautions; it can tolerate limited exposure to moisture before requiring baking.

Technical Specifications

Receiver ICs E-TDA7514TR attributes and parameters. Explore more Receiver ICs devices from STMicroelectronics

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

.02 %

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

80

Nominal Output Voltage (AM):

370 mV

Nominal Output Voltage (FM):

243 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Signal to Noise Ratio (FM):

65 dB

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

E-TDA7514TR General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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