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TEA5712P

NXP Semiconductors

TEA5712P by NXP Semiconductors

TEA5712P by NXP Semiconductors is a versatile audio single-chip receiver with a harmonic distortion of 0.8% and an FM signal-to-noise ratio of 26 dB. It operates b/w 2V to 12V, making it ideal for various audio applications. Its compact design features a rectangular plastic/epoxy package with 32 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,871 parts In-Stock

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1,871

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Anansix

USA . 1,124 parts In-Stock

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1,124

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Digiode

USA . 550 parts In-Stock

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550

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 974 parts In-Stock

1+ parts

$18.800

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974

$18.800

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UNI Independent Distributors

Spain . 5,433 parts In-Stock

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5,433

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Corphita

USA . 2,909 parts In-Stock

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2,909

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Overview

Elevate your audio experience with the TEA5712P from NXP Semiconductors, a trusted leader in innovation. This premium single-chip receiver guarantees crystal-clear sound quality, robust performance, and exceptional reliability in diverse applications—from home entertainment to automotive systems. With its compact design and superior noise handling, the TEA5712P empowers engineers to create cutting-edge devices that resonate with users, ensuring satisfaction and lasting value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures longevity and resistance to environmental factors, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space utilization on PCB, allowing for compact device designs.

General IC Type: AUDIO SINGLE CHIP RECEIVER

As a single-chip audio receiver, this IC simplifies design and reduces overall system costs while maintaining high performance.

Harmonic Distortion: 0.8 %

Low harmonic distortion indicates high signal fidelity, making it suitable for high-quality audio applications.

No. of Terminals: 32

A higher number of terminals offers more connectivity options for various functionalities, enhancing versatility.

Package Style (Meter): IN-LINE, SHRINK PITCH

This style is ideal for automated assembly processes, reducing manufacturing costs and improving efficiency.

Terminal Finish: TIN/NICKEL PALLADIUM GOLD

The gold plating ensures low contact resistance and enhances long-term reliability and performance of connections.

Terminal Position: DUAL

Dual terminal positioning allows for easier layout and improved connection options in circuit designs.

Maximum Seated Height: 4.7 mm

A low seated height allows for its use in space-constrained applications, making it ideal for portable devices.

Nominal Signal to Noise Ratio (FM): 26 dB

A nominal SNR of 26 dB indicates a good balance of audio quality and noise levels, suitable for clear sound transmission.

Width: 10.16 mm

A compact width promotes ease of integration into various device form factors, enhancing design flexibility.

Minimum Supply Voltage (Vsup): 2 V

Supports low supply voltages, making it energy efficient and suitable for battery-operated devices.

Length: 28.95 mm

The manageable length contributes to a compact footprint, facilitating space-efficient designs in electronics.

Demodulation Type: AM/FM

Versatile demodulation capabilities allow for broad application across various audio transmission formats.

Terminal Form: THROUGH-HOLE

Through-hole design provides robust mechanical support and reliable electrical connections, ideal for high-stress environments.

Terminal Pitch: 1.778 mm

A standard pitch spacing allows compatibility with a variety of PCBs, streamlining manufacturing and assembly processes.

Maximum Supply Voltage (Vsup): 12 V

The ability to operate at higher supply voltages expands its application potential in more diverse electronic systems.

Technical Specifications

Receiver ICs TEA5712P attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

AM/FM

Harmonic Distortion:

.8 %

JESD-30 Code:

R-PDIP-T32

JESD-609 Code:

e3/e4

Length:

28.95 mm

No. of Terminals:

32

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Nominal Signal to Noise Ratio (FM):

26 dB

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

NO

Terminal Finish:

TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

TEA5712P General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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