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TDA1072AT/V4,112

NXP Semiconductors

TDA1072AT/V4,112 by NXP Semiconductors

NXP Semiconductors TDA1072AT/V4,112 is an audio single chip receiver with 1% harmonic distortion. It operates b/w -40 to 80°C and requires a supply voltage of 7.5-10V. This small outline IC is ideal for AM demodulation applications due to its compact size and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,648 parts In-Stock

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5,648

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Digiode

USA . 1,771 parts In-Stock

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1,771

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Anansix

USA . 334 parts In-Stock

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334

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 320 parts In-Stock

1+ parts

$1.410

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320

$1.410

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Corohmni

South Africa . 119 parts In-Stock

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$1.889

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119

$1.889

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One Stop Electronics

USA . 1,315 parts In-Stock

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$3.800

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1,315

$3.800

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Ampacity Inc.

Singapore . 318 parts In-Stock

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$3.800

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318

$3.800

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$4.479

100+ parts

$4.076

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$3.673

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1,000

$4.479

$4.076

$3.673

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Semicontronic

India . 253 parts In-Stock

1+ parts

$15.800

100+ parts

$15.405

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$15.326

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253

$15.800

$15.405

$15.326

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AZTECH Wire

Italy . 305 parts In-Stock

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$16.508

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305

$16.508

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UNI Independent Distributors

Spain . 6,018 parts In-Stock

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Corphita

USA . 4,775 parts In-Stock

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Continental Prestige Electronics

USA . 4,344 parts In-Stock

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Argo Parts USA

USA . 2,955 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unlock the power of seamless audio reception with the TDA1072AT/V4,112 by NXP Semiconductors. Crafted with precision and expertise, this receiver IC offers unparalleled quality and reliability for a wide range of applications. With its compact design and advanced technology, this audio single chip receiver ensures minimal distortion and maximum performance. Elevate your audio experience and stay connected with the TDA1072AT/V4,112.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the receiver IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Harmonic Distortion: 1%

Ensures high-quality audio output with minimal distortion, providing a clear and crisp sound experience.

No. of Terminals: 16

Offers versatility in connectivity options and compatibility with various circuit configurations.

Minimum Operating Temperature: -40 °C

Can withstand extremely low temperatures, making it suitable for use in a wide range of environments.

Maximum Supply Voltage (Vsup): 10 V

Supports a higher supply voltage for improved performance and reliability in power management.

Technical Specifications

Receiver ICs TDA1072AT/V4,112 attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

AM

Harmonic Distortion:

1 %

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Voltage (AM):

310 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

27 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

7.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

TDA1072AT/V4,112 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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